Abnormal substance removing device for semiconductor packaging

Abstract

The invention provides a foreign matter removing device for semiconductor packaging, which comprises a shell, an empty slot is formed in the left end of the shell, a cover plate is arranged above the empty slot, a motor and an auxiliary motor are symmetrically arranged at the front end and the rear end of the empty slot respectively, a time recorder is arranged above the auxiliary motor, and the motor and the auxiliary motor are connected with the two ends of a rotating shaft through couplings respectively. Limiting rings are arranged at the two ends of the rotating brush, and a rotating speed measuring instrument is arranged on the right side of the rotating shaft. According to the invention, the residual foreign matters on the mold can be effectively cleaned, the badness caused in the packaging process is avoided, the yield of products is improved, the original mode of manually cleaning the foreign matters is automatically replaced, the waste of manpower is reduced, the downtime is shortened, and the output of equipment is improved.

Description

technical field [0001] The invention mainly relates to the field of semiconductor packaging, in particular to a foreign matter removal device for semiconductor packaging. Background technique [0002] At present, during the resin packaging process of substrates and chips, due to the chemical properties of the resin, some substances in the resin often remain. Over time, foreign substances will be formed, which not only affects the service life of the packaged device, but also causes a lot of defects during normal operation. Occurrence, manual removal requires downtime for cleaning, wasting a lot of time and reducing output, which urgently needs to be improved. Contents of the invention [0003] In view of the above-mentioned defects of the prior art, the present invention provides a foreign matter removal device for semiconductor packaging, which includes a housing 8, an empty slot is provided at the left end of the housing 8, a cover plate 80 is provided above the empty sl...

AI Technical Summary

Problems solved by technology

[0002] At present, during the resin packaging process of substrates and chips, due to the chemical properties of the resin, some substances in the resin often remain. Over time, foreign substances will be formed, which not only affects the service life of the packaged device, but also causes a lot of defects during normal operation. Occurrence, manual cleaning needs to stop for cleaning, waste a lot of time, reduce output, and urgently need to be improved

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