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Processing and electroplating device and method for electrical FPC (Flexible Printed Circuit)

An electroplating device and electrical technology, applied in the direction of electrical components, electrolytic components, electrolytic process, etc., can solve the problems of falling into the electroplating pool, low efficiency, and different FPC sizes, and achieve the effect of improving production efficiency

Pending Publication Date: 2022-05-27
深圳市鑫联盈科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] FPC needs to be electroplated after the front-end treatment is completed. Due to mold problems during demoulding, there may be burrs on the four sides of the FPC, which will fall into the electroplating pool during electroplating treatment, and the size of the FPC that is demoulded due to different molds is different. , needs to be automatically adjusted during transportation. The domestic production quality inspection of FPC mainly relies on manual operation, which is high in cost and low in efficiency, and needs to be automated. For this reason, we propose an electrical FPC processing and electroplating device and its method to solve the above problems. question

Method used

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  • Processing and electroplating device and method for electrical FPC (Flexible Printed Circuit)
  • Processing and electroplating device and method for electrical FPC (Flexible Printed Circuit)
  • Processing and electroplating device and method for electrical FPC (Flexible Printed Circuit)

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Embodiment Construction

[0037] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0038]In the description of the present invention, it is to be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inside", "around", etc. Indicates the orientation or positional relationship, only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientat...

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Abstract

The invention discloses a processing and electroplating device and method for an electrical FPC. The processing and electroplating device comprises a bottom support, an electroplating pool is arranged in the bottom support, a first moving plate in sliding fit is arranged above the electroplating pool, a first lifting plate in sliding fit is arranged above the first moving plate, a first rotating frame is arranged above the first lifting plate, and a second rotating frame is arranged above the first rotating frame. A first mounting plate which is fixedly connected is arranged on the mounting platform, a second moving plate which is in sliding fit is arranged on the first mounting plate, a first mounting frame and a movable second mounting frame which are fixedly connected are arranged above the second moving plate, a suction assembly is arranged above the first mounting frame and the second mounting frame, and a shaping assembly is arranged at one end of the suction assembly. According to the machining electroplating device, automatic feeding design is adopted, automatic adjusting and positioning can be achieved according to the size of the FPC, overall operation is automatically completed, the cutting distance can be automatically adjusted according to the actual use condition, buffer structures are arranged on the upper portion and the lower portion, and the machining electroplating device can be automatically taken away for electroplating operation after shaping is completed.

Description

technical field [0001] The invention relates to the technical field of FPC processing, in particular to an electrical FPC processing and electroplating device and a method thereof. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit, FPC), also known as flexible circuit board, flexible circuit board, is favored for its excellent characteristics such as light weight, thin thickness, and free bending and folding. With the rapid development of the electronics industry, the design of circuit boards is becoming more and more high-precision and high-density, and the traditional manual detection methods can no longer meet the production needs. FPC defect automatic detection has become an inevitable trend of industrial development. [0003] Flexible circuit board (FPC) is a technology developed by the United States for the development of aerospace rocket technology in the 1970s. It is made of polyester film or polyimide as a base material with high...

Claims

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Application Information

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IPC IPC(8): H05K3/18C25D7/00C25D17/06C25D21/10
CPCH05K3/188C25D7/00C25D17/06C25D21/10H05K2203/0723
Inventor 雷雪娇邓家波裴宏军雷媛
Owner 深圳市鑫联盈科技有限公司
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