A conductive device for chip testing

Abstract

The invention discloses a conductive device for chip testing, which includes a wire winding device. The wire winding device includes a top block, a conductive column, a gear a, a mounting column, a gear b, a curved rod and a crank handle, which can accommodate the wires, and when necessary It can be pulled out to extend the use length of the wire to adapt to different connection distances; the protection device includes a connecting column a, a connecting column b, a tin bead, a permanent magnet a and a permanent magnet b, which can be used by the heating effect of the resistance when the line is short-circuited. The tin beads are melted, and the repulsive force between the permanent magnet a and the permanent magnet b makes the connection post a and the connection post b disconnected from the electrical connection, so as to protect the chip and the circuit board from short circuits and reduce potential safety hazards.

Description

technical field [0001] The invention relates to the technical field of conductive connection, in particular to a conductive device for chip testing. Background technique [0002] In the manufacturing process of the chip, in order to ensure that the produced chip is qualified, the chip needs to be sampled. The general practice is to install the chip on the corresponding circuit board, but in order to ensure electrical conductivity, the chip needs to be welded, but this It will cause the chip after sampling inspection to be unable to continue to return to the production line, which will cause product waste and increase production costs. Another method is to connect the chip and the corresponding circuit board through a conductive device, so that a circuit connection is formed between the two, and then the test is achieved. The purpose and advantage is that there is no need for soldering processing, and the qualified chips can continue to return to the production line, avoiding...

AI Technical Summary

Problems solved by technology

[0002] In the manufacturing process of the chip, in order to ensure that the produced chip is qualified, it is necessary to conduct random inspection on the chip. The general method is to install the chip on the corresponding circuit board, but in order to ensure the conductivity, the chip needs to be soldered, but this It will cause the chips after random inspection to fail to return to the production line, which will cause waste of products and increase production costs. Another method is to connect the chips to the corresponding circuit boards through a conductive device, so that a circuit connection is generated between the two, and then the test can be achieved. The advantage is that there is no need for soldering, and the qualified chips can continue to return to the production line, avoiding the waste of products. However, the traditional conductive device uses one-to-one connection, so that the chip pins are inserted into the mounting holes of the circuit board. During the connection process There is a risk of connection errors, which will lead to a short circuit of the entire test circuit in severe cases, resulting in the burning of the chip and circuit board, resulting in damage to the test device, which poses a safety hazard

[0003] As proposed in CN202111096135.9, a conductive connection structure applicable to modular electrical components includes a conductive connection structure connected between two adjacent modular electrical components, and the conductive connection structure includes: a conductive thimble; The first limiting structure between the conductive thimble and one of the modular electrical components, and the first limiting structure includes a limiting spring; a conductive collar; connected between the conductive collar and another modular electrical component Between the second limit structure, and the second limit structure includes a compensation spring; the end of the conductive thimble away from the limit spring can be in contact with the end of the conductive collar away from the compensation spring, and the conductive thimble When contacting the conductive collar, at least one of the limit spring and the compensation spring is compressed; in summary, the stability and reliability of the contact between the conductive thimble and the conductive collar can be effectively improved, and the overall structure is simple and easy to disassemble, but the invention The one-to-one connection cannot provide short-circuit protection for the test line, which also has potential safety hazards, and the invention does not store the conductive wires, which makes the conductive wires easy to be entangled during use, increasing the risk of connection errors

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