396results about How to "Poor contact" patented technology

Embodiments of the invention provide a method, devices, and system for monitoring and sharing emotion-related data from one or more persons connected via the internet. An emotion monitoring device (EMD) measures physiological signals obtained from biosensors and computes emotion states relating to emotional arousal and valence. Various signal processing methods are employed to reduce artifact and improve the detection of emotional states. The EMD communicates the emotion data to an internet server via a wireless network. The internet server transmits the emotion data to other persons equipped with an EMD. Their emotion data similarly is obtained and shared with others. The networked emotion data can used to enrich online, community experiences such as games and social networks. An implementation of an EMD based on a smart phone enables emotion data to be monitored in wide area, mobile environment. The biosensors can be integrated into the casing or a cover for the mobile phone.

A semiconductor device having reliable electrode contacts. First, an interlayer dielectric film is formed from a resinous material. Then, window holes are formed. The interlayer dielectric film is recessed by oxygen plasma. This gives rise to tapering window holes. This makes it easy to make contacts even if the circuit pattern is complex.

A touch sensing display panel includes a first substrate, a second substrate, a touch sensing device, a patterned electrode layer, an insulating layer, and a sealant. The first substrate has a touch sensing region, and a sealant region surrounding the touch sensing region. The touch sensing device is disposed on an inner surface of the first substrate in the touch sensing region. The patterned electrode layer is disposed on the inner surface of the substrate in the sealant region, and the patterned electrode layer includes a plurality of connecting lines electrically connected to a touch sensing device, and an auxiliary electrode. The auxiliary electrode is not directly electrically connected to the connecting lines and the touch sensing device. The sealant is disposed between the first substrate and the second substrate in the sealant region, and at least one of the connecting lines and the auxiliary electrode overlap the sealant.

In a battery pack, a battery core pack having a connector is inserted into a resin molded portion which is formed of a plastic material. The battery core pack includes a rechargeable unit cell, a circuit board electrically connected to the unit cell, and a connector fixed to the circuit board. The connector incorporates a contact point in a connector casing which is formed of an insulation material, and the connector casing is inserted into the resin molded portion so as to partially appear to a surface of the resin molded portion. Further, the battery pack is provided with a sealing groove at a boundary between the connector casing and the resin molded portion, along a peripheral edge of an exposed portion of the connector, appearing outside the resin molded portion.

A fabrication method of a selective emitter solar cell, including: forming a selective emitter solar cell base having a buried grid electrode; forming an anti-reflection layer on the emitter surface of the solar cell base; forming a bus-bar on the anti-reflection layer; and connecting the buried grid electrode with the bus-bar in the traversing direction underneath through the anti-reflection layer. Accordingly, the invention provides a selective emitter solar cell. With the method of the invention, emitters and bus-bars are made separately, the width of the emitters can be reduced according to actual needs, the area that is unnecessarily taken may be reduced, the effective area for a solar cell panel to receive sunlight may be increased. The invention improves conversion efficiency of a selective emitter solar cell panel from 16.5% to 18% or more.

An electrical testing substrate unit includes a multi-layer ceramic substrate formed of mullite and a borosilicate glass as predominant ceramic components. In the multi-layer ceramic substrate, the borosilicate glass contains an alkali metal oxide in an amount of 0.5 to 1.5 mass %. The multi-layer ceramic substrate has a mean coefficient of linear thermal expansion having a value of 3.0 to 4.0 ppm/° C. between −50° C. and 150° C. A thermal expansion coefficient, α1, of the multi-layer ceramic substrate as determined at a particular temperature and a thermal expansion coefficient, α2, of a to-be-tested silicon wafer as determined at the same temperature silicon satisfy a relation: 0 ppm/° C.<α1−α2≦2.5 ppm/° C. through the temperature range of −50° C. to 150° C. Electrodes are formed on a surface of the multi-layer ceramic substrate.

The invention relates to a manufacturing method and a system of a radio frequency self-adhesive label, and the manufacturing method of the radio frequency self-adhesive label comprises the following steps: a) using conductive ink to print an antenna on an inner layer of a surface material film of a thin film; b) mounting a chip; c) testing an electronic device; d) coating silicone oil on the surface of a release material substrate; e) curing a silicone oil release layer; f) coating hot melt adhesive on the silicone oil release layer; g) curing the hot melt adhesive; h) compounding the tested electronic device layer with the release layer coated with the adhesive; i) carrying out die cutting and waste discharge; and j) taking up and obtaining a finished product which can be stuck automatically or manually. The manufacturing method of the radio frequency self-adhesive label can meet the technical requirements of the market on the radio frequency self-adhesive label, has significant advantages in the aspects of manufacturing efficiency, product yield, durability and economy, and can solve the shortcomings of the existing process, and the popularization of the manufacturing method of the radio frequency self-adhesive label is conductive to the wide applications of the radio frequency technology.

The invention relates to a high-power LED packaging structure. The packaging structure is characterized in that an aluminum heat sink (6) is in the structure of an inverted T; a scalelike heat-dissipation plate (10) integrated with the aluminum heat sink (6) extends under the aluminum heat sink; an extending arm of the aluminum heat sink (6) is connected with a printed circuit board (9), the center of the aluminum heat sink (6) is provided with a semi-spherical surface concave cavity; a chip (3) is adhered to a lug boss on the inner bottom surface of the semi-spherical surface concave cavity; flexible silica gel (5) is packaged inside the semi-spherical surface concave cavity comprising the chip (3); and the top surface of the flexible silica gel (5) is coated with a fluorescent powder layer (2). The high-power LED packaging structure ensures that the heat of an LED can be dissipated quickly, thereby increasing the light-emitting stability and service life of high-power LEDs.

Provided are a gas decomposing unit and an electrode for a fuel cell capable of stably supporting a gas decomposing catalyst. A gas decomposing unit and an electrode for a fuel cell each including: a carbon nanotube structure having a mesh structure in which functional groups bonded to plural carbon nanotubes are chemically bonded to mutually cross-link the plural carbon nanotubes; and a gas decomposing catalyst supported on the carbon nanotube structure. A method of manufacturing a gas decomposing unit characterized by including: an applying step of applying, to the surface of a substrate, a solution containing plural carbon nanotubes to which functional groups are bonded; a cross-linking step of chemically bonding the functional groups to build a mesh structure in which the plural carbon nanotubes mutually cross-link; and a supporting step of forming the carbon nanotube structure supporting a gas decomposing catalyst.

This invention is about the electric connector and its processing technique. More specifically, it involves terminals with puncture structure, electric connector and their processing technique. The processing technique herein includes stamping terminal processing, winding displacement processing, injection upper cover, injecting lower cover, piercing processing, removal of material ribbon, front glue chip assembly, assembly of outer metal shell. Among them, the upper cover and lower cover are injected and molded in the middle and rear of the corresponding terminals in array. The processing technique has tackled the problems as unstable contact, poor contact, high electric resistance and micromation which cannot be solved by the current existing electric connector. There should be at least two tusks whose tips are intertwined molded in the electric connector of piercing terminal. The tusks are the pyramid shape with a cambered surface in the inner side; it reduces the electric resistance of electric connector. The upper and lower covers of piercing HDMI electric connector are respectively molded in the arrayed terminals. The rear end of the terminal has molded piercing tusk. The electric connector has become smaller and lighter, improving its performance in every aspect significantly.

A liquid crystal display device and a method of fabricating the same that is capable of speeding up a data charge time in a liquid crystal pixel cell in a liquid crystal display device with a high aperture ratio overlapping a pixel electrode and a signal wiring. In the device, a thickness and a dielectric constant of the organic insulating film are set such that a signal delay at the gate line and the data line can be reduced.

A display and a sub-pixel driving method therein are provided. The display includes a data line and a sub-pixel. The data line is configured to provide a data voltage signal. The sub-pixel includes a driving unit, a first light-emitting unit and a second light-emitting unit. The driving unit is configured to generate a driving current according to the data voltage signal. The first light-emitting unit is configured to emit light by the driving current and generate an operating voltage according to the driving current. The second light-emitting unit is selectively substituted for the first light-emitting unit to emit light according to a variation of the operating voltage.

An electronic component mounting board, including: a substrate base made of a flat-plate-like elastic body, the substrate base having a plurality of through-holes in a manner spaced a predetermined distance apart from each other; conductive members, each of which has a main unit portion filled in the through-hole, the main unit portion having a first protrusion portion and a second protrusion portion respectively on a first end and a second end thereof, with the first protrusion portion arranged so as to protrude from a first surface of the substrate base and the second protrusion portion arranged so as to protrude from a second surface of the substrate base; a flexible substrate that is arranged on the first surface of the substrate base and that has first opening portions for penetration of the first protrusion portions; and a plurality of oval electrodes arranged on the substrate, each of which has a second opening portion for penetration of the first protrusion portion, in which the electrodes are arranged in a manner spaced apart from each other, and each of the second opening portions is formed on a first end side of each of the electrodes.

A conductive paste for a photovoltaic cell and a method for producing the photovoltaic cell are disclosed. The conductive paste includes a silver powder, glass frit and a sintering inhibitor that suppresses sintering of the silver powder. The sintering inhibitor contains at least one substance selected from aluminum oxide, silicon oxide and silicon carbide. The method includes forming a first anti-reflective layer on a first region of a main surface of a semiconductor substrate; forming a second anti-reflection layer on a second region of the main surface which is different from the first region; coating the electrically conductive paste onto the second anti-reflective layer on the second anti-reflection layer; and forming a surface electrode in the second region by reacting the second anti-reflection layer with the electrically conductive paste at an elevated temperature.

The embodiment of the invention discloses an organic light-emitting diode display panel and a production method thereof. The organic light-emitting diode display panel comprises a first substrate and a second substrate which are oppositely arranged, wherein the first substrate comprises a first lead wire connected with a negative electrode; the second substrate comprises a second lead wire connected with a peripheral circuit; the first lead wire is connected with the second lead wire through a connecting part. According to the technical scheme adopted by the invention, the negative electrode is connected with the peripheral circuit through the first lead wire, the connecting part and the second lead wire, the first lead wire is arranged on the first substrate and the second lead wire is arranged on the second substrate, so that the first lead wire and the second lead wire are difficult to break, poor contact, caused by easy breakage of the lead wires, between the negative electrode and the peripheral circuit in the prior art is avoided, good contact between the negative electrode and the peripheral circuit is ensured, and thus good display of the OLED (organic light-emitting diode) display panel is achieved.

The invention discloses an unmanned aerial vehicle multiplex video switching device. According to the multiplex video switching device, a main control unit is controlled with a thumb wheel switch or an industrial personal computer so as to cause the main control unit to drive a multiplex switching unit, so the input not only can be switched to the output, and but also can be outputted to different output channels according to a certain time sequence, and a power amplification circuit is designed in the circuit for video output signals at the same time, so the distributed capacitance can be effectively reduced, the circuit board area can be reduced and the operation of the whole system is more stable. The multiplex switching unit of the invention adopts a eight-channel video high-speed multiplexing chip produced by the MAX company, the switching time is 40ns, and compared with a multiplex mechanical switch of a passive switching device, the large contact noise problem occurring in the switching process does not exist, and the poor contact problem also does not exist.

The outer surface of a core pipe 31 is pressed so as to form projections 313 on the inner surface of the core pipe 31, and a winding pipe 32 is helically wound around the outer circumference of the core pipe 31. Subsequently, the core pipe 31 and the winding pipe 32 are bent together, and brazing is performed. As a result, the outer surface of the winding pipe 32 is in contact with the outer surface of the core pipe 31 without any gap therebetween at a bending center portion (D), and the outer surface of the winding pipe (32) is bonded to the outer surface of the core pipe (31) by a brazing material (33) at the bending center portion (D) of the bent part C-C.

The invention discloses an array substrate, a display device and a manufacture method of the array substrate. The array substrate comprises an IC crimping region including an IC region and a terminal region arranged on one side of the IC region and near an edge of the array substrate. The terminal region is provided with a plurality of transmission terminals. The IC region comprises a conductor layer, a first insulating layer, a separating layer and a second insulating layer stacked one by one. Each transmission terminal comprises a first conductive layer which is arranged on the second insulating layer and extends from the terminal region to the IC region. The separating layer is arranged in the IC region and at least overlaps with the first conductive layers extending to the IC region. When a small-size IC chip is adopted, contact failure between the IC chip and the terminals of the array substrate can be prevented. Meanwhile, short circuit risks between the first conductive layers and the conductor layer can be avoided.

Provided is a semiconductor testing apparatus that a testing pin is rendered to electrically connect to another testing pin or an external substrate through a conductive layer formed in the guide hole, so that it results in enhancement in various characteristics such as poor electrical contact of the testing pin, space efficiency, noise, and high frequency characteristics, thereby improving reliability in testing results.