Array substrate, display device and manufacture method of the array substrate

A technology of an array substrate and a manufacturing method, applied in the field of flat panel display, can solve the problems of poor contact between IC chips and array substrate terminals, increased short circuit of wiring, and reduced contact area, etc.

Active Publication Date: 2014-09-24
SHANGHAI TIANMA MICRO ELECTRONICS CO LTD +1
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Problems solved by technology

However, under the premise that the design structure of the array substrate remains unchanged, if the IC chip is too small, when the IC chip is bound, the output pin of the IC chip should be matched with the output terminal first. At this time, the input pin of the IC chip will

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  • Array substrate, display device and manufacture method of the array substrate
  • Array substrate, display device and manufacture method of the array substrate
  • Array substrate, display device and manufacture method of the array substrate

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[0021] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0022] The array substrate usually includes a display area and a frame area, the display area includes a plurality of pixel units arranged in a matrix, each pixel unit is provided with a thin film transistor switch, and the screen display is realized by controlling the liquid crystal molecules in the pixel unit, and the frame area surrounds the display. The periphery of the area is used for setting peripheral circuits to provide the pi...

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Abstract

The invention discloses an array substrate, a display device and a manufacture method of the array substrate. The array substrate comprises an IC crimping region including an IC region and a terminal region arranged on one side of the IC region and near an edge of the array substrate. The terminal region is provided with a plurality of transmission terminals. The IC region comprises a conductor layer, a first insulating layer, a separating layer and a second insulating layer stacked one by one. Each transmission terminal comprises a first conductive layer which is arranged on the second insulating layer and extends from the terminal region to the IC region. The separating layer is arranged in the IC region and at least overlaps with the first conductive layers extending to the IC region. When a small-size IC chip is adopted, contact failure between the IC chip and the terminals of the array substrate can be prevented. Meanwhile, short circuit risks between the first conductive layers and the conductor layer can be avoided.

Description

technical field [0001] The invention relates to flat panel display technology, in particular to an array substrate, a display device and a manufacturing method of the array substrate. Background technique [0002] Flat panel display devices have the advantages of thinness, low power consumption, and low radiation, and are widely used in various fields. With the rapid development of science and technology, people have higher and higher quality requirements for flat panel display devices. Wide viewing angles, ultra-thin, and narrow bezels have gradually become important factors for selecting flat panel display devices. [0003] COG packaging (chip on glass) is a packaging technology that directly binds the driver chip on the glass. This method can greatly reduce the volume of the entire flat panel display device and reduce the number of wiring and layers on the printed circuit board. , reducing board size and complexity, reducing overall cost. [0004] figure 1 It is a stru...

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Application Information

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IPC IPC(8): H01L27/12G02F1/1362G02F1/1368
Inventor 谢正芳王磊沈新乐孔祥建
Owner SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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