High-power LED heat-dissipation packaging structure

A packaging structure, high-power technology, applied in cooling/heating devices of lighting devices, lighting devices, lighting and heating equipment, etc., can solve the problems of luminous efficiency decline, luminous yellow/blue spots, poor consistency, etc., and reach the contact surface Reduce, increase heat dissipation performance, and avoid the effect of increasing thermal resistance
CN101696790AInactive Publication Date: 2010-04-21IRICO
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
IRICO
Publication Date
2010-04-21
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a high-power LED packaging structure. The packaging structure is characterized in that an aluminum heat sink (6) is in the structure of an inverted T; a scalelike heat-dissipation plate (10) integrated with the aluminum heat sink (6) extends under the aluminum heat sink; an extending arm of the aluminum heat sink (6) is connected with a printed circuit board (9), the center of the aluminum heat sink (6) is provided with a semi-spherical surface concave cavity; a chip (3) is adhered to a lug boss on the inner bottom surface of the semi-spherical surface concave cavity; flexible silica gel (5) is packaged inside the semi-spherical surface concave cavity comprising the chip (3); and the top surface of the flexible silica gel (5) is coated with a fluorescent powder layer (2). The high-power LED packaging structure ensures that the heat of an LED can be dissipated quickly, thereby increasing the light-emitting stability and service life of high-power LEDs.
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Description

technical field

[0001] The invention relates to a package structure of a high-power LED, in particular to a package structure with uniform light emission and favorable heat dissipation of the high-power LED. Background technique

[0002] LED (Light Emitting Diode) is a semiconductor light-emitting device. It is expected to become the next-generation lighting source due to its advantages such as high light efficiency, energy saving, high environmental protection and safety, long life, fast response, and low operating cost. In the context of increasingly scarce resources and deteriorating environment, energy-saving and environmentally friendly LED products have huge market prospects.

[0003] At present, LED is widely used in landscape lighting, signal lights, automobile industry, backlight module, daily lighting and other fields, and its advantages are gradually emerging. However, with the wide application of LEDs, in the process of replacing other light sources, the market ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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