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Electro-optical package and method of manufacture

A technology of integrated circuits and printed circuit boards, applied in the field of electro-optical packaging

Pending Publication Date: 2022-06-17
ROCKLEY PHOTONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in some cases, the part-to-part thickness variation of the parts used to construct the electro-optical package can be significant for the target wire bond length
Such variations can be an obstacle to forming short wire bonds

Method used

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  • Electro-optical package and method of manufacture
  • Electro-optical package and method of manufacture
  • Electro-optical package and method of manufacture

Examples

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Embodiment Construction

[0029] The detailed description set forth below in connection with the appended drawings is intended as a description of exemplary embodiments of electro-optical packages and methods for making electro-optical packages provided in accordance with the present disclosure, and is not intended to represent the only form in which the present disclosure may be constructed or utilized. The description sets forth the features of the present disclosure in conjunction with the illustrated embodiments. It should be understood, however, that the same or equivalent functions and structures may be implemented by different embodiments, which are also intended to be included within the scope of the present disclosure. As indicated elsewhere herein, similar element numbers are intended to indicate similar elements or features.

[0030] In an electro-optical package, various components or interconnects may be connected to each other by wire bonds, which in some embodiments may be short in order...

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Abstract

An electro-optical package. In some embodiments, the package comprises: a carrier; a first integrated circuit, wherein the first integrated circuit is located on the carrier; the first bonding layer is positioned between the carrier and the first integrated circuit; the thermoelectric cooler is positioned on the carrier; the second integrated circuit is positioned on the thermoelectric cooler; and a first wire bonding member. The first wire bond may connect a first pad on the first integrated circuit to a second pad on the second integrated circuit, the first pad and the second pad having a height difference of less than 100 microns.

Description

technical field [0001] One or more aspects of embodiments in accordance with the present disclosure relate to electro-optical packaging, and more particularly, to a system and method for enabling the formation of short wire bonds in such packaging. Background technique [0002] In electro-optical packages designed for high speed operation, different integrated circuits (eg, photonic integrated circuits and electronic integrated circuits) may be connected together or to other components by wire bonds, and short wire bonds may be advantageous such that Wire bond connections can have high bandwidth. However, in some cases, the part-to-part thickness variation of the parts used to construct the electro-optic package can be significant for the target wire bond length. Such variations can be an obstacle to forming short wire bonds. SUMMARY OF THE INVENTION [0003] According to an embodiment of the present invention, there is provided an assembly comprising: a carrier; a first...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/38H01L23/538H01L25/16H01L25/18H01L21/50
CPCH01L23/38H01L23/5386H01L25/167H01L25/18H01L25/50H01L24/48H01L2224/48137G02B6/4271H10N10/00H01L23/52H01L23/34H01L24/43H01L24/44H01L2924/14
Inventor 李书和G·C·拜尔德
Owner ROCKLEY PHOTONICS INC