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Novel ultrasonic thickness measuring system

An ultrasonic and ultrasonic echo technology, applied in the direction of using ultrasonic/sonic/infrasonic waves, measuring devices, instruments, etc., can solve problems such as hidden safety hazards, high requirements for acquisition boards and circuit design, etc., to reduce risks and improve safety. and reliability, the effect of simplifying the measurement circuit

Pending Publication Date: 2022-06-24
CHINA JILIANG UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, in the measurement circuit for the thickness of steel and other equipment, the ultrasonic transmitting circuit generally uses a transformer boost to achieve the high voltage required by the ultrasonic probe, which has great potential safety hazards, and most ultrasonic receiving circuits use complex circuits to achieve signal acquisition. and transmission, higher requirements for the design of acquisition boards and circuits

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  • Novel ultrasonic thickness measuring system
  • Novel ultrasonic thickness measuring system
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Embodiment Construction

[0029] In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

[0030] Below in conjunction with accompanying drawing, the present invention is described in further detail:

[0031] A new type of ultrasonic thickness measurement system, such as figure 1 As shown, it includes a host computer 1, a signal processing unit 2, an ultrasonic sensor probe 3, and a workpiece to be measured 4, wherein the signal ...

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Abstract

The invention discloses a novel ultrasonic thickness measuring system. A trigger program is written in an upper computer and downloaded to an FPGA control panel; the FPGA control panel generates a trigger signal according to a program; the ultrasonic transmitting circuit generates sharp pulse signals under the action of the trigger signals; the ultrasonic probe emits ultrasonic waves under the action of the sharp pulse signals; the ultrasonic waves are reflected in different media to form ultrasonic echo signals; an ultrasonic echo signal received from the probe enters the ultrasonic receiving circuit for signal preprocessing; the FPGA control panel counts the ultrasonic echoes through a counter, the rising edge time of the received first ultrasonic echo signal is recorded as D1, the rising edge time of the received second ultrasonic echo signal is recorded as D2, the thickness of the material is calculated according to the D1, the D2 and the sound velocity of the ultrasonic waves in the corresponding material, and the material thickness is transmitted to an upper computer to be displayed; according to the scheme, the thickness of materials such as pipe walls can be automatically measured, a measuring circuit is simplified, the requirement for an acquisition board card is lowered, the danger of a high-voltage circuit is lowered, and therefore the safety and reliability of measurement are further improved.

Description

technical field [0001] The invention relates to the field of non-destructive testing, in particular to a novel ultrasonic thickness measurement system. Background technique [0002] In recent years, with the continuous increase of investment in infrastructure such as petroleum and chemical industry, the demand for materials such as steel and iron has continued to increase, and the measurement requirements for the thickness of related devices have become higher and higher, and thickness measurement technology has developed rapidly. Relevant devices have been operating in harsh environments such as flame, moisture and corrosion for a long time. Factors such as corrosion, wear and tear can easily lead to thinning of pipe walls and wall tanks, and even accidents such as leakage and explosion, which seriously affect the lives and properties of the people. Safety. Therefore, wall thickness detection is an important part of wall pipe maintenance. [0003] At present, in the measu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B17/02
CPCG01B17/02
Inventor 王茂龙吴善强
Owner CHINA JILIANG UNIV