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Liquid film transfer printing method of surface microstructure

A microstructure and liquid film technology, applied in microstructure technology, microstructure devices, manufacturing microstructure devices, etc., can solve problems such as poor controllability and poor orientation, less requirements for preparation conditions, high transfer efficiency, low cost effect

Pending Publication Date: 2022-06-28
JIANGSU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Mechanical processing can only obtain simple microstructure surfaces such as protrusions, grooves, and micropores; the surface microstructure obtained by chemical treatment is a random microstructure with poor orientation; the microstructure formed by material deposition is related to the deposition process, and realizes Oriented microstructure usually requires a suitable atmosphere (high vacuum), suitable materials and suitable process conditions, and the controllability is poor

Method used

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  • Liquid film transfer printing method of surface microstructure
  • Liquid film transfer printing method of surface microstructure
  • Liquid film transfer printing method of surface microstructure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0037] Example: LiOH solution is used to prepare a liquid film with fine substances attached, and the microstructure surface 6 is a silicon wafer processed by laser

[0038] see attached Figure 5, using the laser direct writing method to prepare a well-shaped groove structure on the surface of the silicon wafer to form a laser-processed microstructure surface 11, the width of the recessed part 12 of the laser-processed microstructure surface is about 50 μm, and the surface is silanized to improve the surface. Adhesion of fine substances. The prepared laser-machined microstructure surface 11 is placed horizontally, and a small amount of broken silicon wafers are laid on the laser-machined microstructure surface 11 as a spacer block. Pour a small amount of LiOH solution onto a smooth silicon wafer, spread the LiOH solution into a thin liquid film by blowing air, and blow carbon dioxide gas to the liquid film to make the surface of the liquid film react to generate fine substan...

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Abstract

The invention discloses a liquid film transfer printing method of a surface microstructure, and belongs to the technical field of functional surface preparation, the method comprises the following steps: preparing a microstructure surface; preparing a liquid film to which fine substances are attached; fine substances attached to the liquid film are in contact with the surface of the microstructure; vibrating the liquid film to transfer fine substances to the surface of the microstructure; and processing the surface of the micro-structure attached with the micro-fine substances. When the liquid film is vibrated, the micro-fine substances corresponding to the concave or convex positions on the surface of the microstructure are subjected to unstable transfer, so that the transfer printing of the micro-fine substances on the liquid film to the surface of the microstructure is realized.

Description

technical field [0001] The invention relates to the technical field of functional surface preparation, in particular to a method for realizing transfer of surface microstructures through a liquid film. Background technique [0002] Appropriate microstructures on functional surfaces can play specific roles on light, sound, electricity, magnetism, heat, and matter, and have received extensive attention from academia and engineering. On some functional surfaces such as superoleophobic surfaces, not only microstructures are required, but also microstructures are required to have suitable orientations. For example, the large ends of mushroom-shaped microstructures on superoleophobic surfaces need to face outwards. Therefore, the surface microstructures Orientation regulation has received extensive attention in recent years. [0003] In general, the surface microstructure can be achieved by means of mechanical processing, chemical treatment, material deposition, etc., but these m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00B41M5/025
CPCB41M5/025B81C1/00555B81C2201/0147
Inventor 李健金卫凤沈涛费潇
Owner JIANGSU UNIV
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