Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Interlocking condition detection method and semiconductor process equipment

A technology for process equipment and condition detection, applied in the directions of comprehensive factory control, comprehensive factory control, program control, etc., can solve the problem that the semiconductor process equipment cannot quickly determine the fault point, so as to improve the efficiency of troubleshooting, quickly determine, and narrow the troubleshooting. range effect

Pending Publication Date: 2022-06-28
XIAN NAURA MICROELECTRONICS EQUIP CO LTD +1
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the embodiments of the present invention is the problem that the fault point cannot be quickly determined in the troubleshooting stage of semiconductor process equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Interlocking condition detection method and semiconductor process equipment
  • Interlocking condition detection method and semiconductor process equipment
  • Interlocking condition detection method and semiconductor process equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] In order to make the above objects, features and advantages of the embodiments of the present invention more clearly understood, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and specific implementation manners.

[0032] refer to figure 1 , showing a flow chart of the steps of an embodiment of an interlock condition detection method provided in this embodiment. The method is applied to semiconductor process equipment and may include:

[0033] Step 101: Acquire a plurality of interlock lists of the active devices in response to the activation signal of the active device of the semiconductor process equipment.

[0034] Wherein, each interlock list includes a category of interlock conditions and target condition values ​​of the interlock conditions.

[0035] In this embodiment, the interlock condition detection method may be implemented by a lower computer in the semiconductor process equipme...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention provides an interlocking condition detection method and semiconductor process equipment, which are applied to the technical field of semiconductor equipment, and the method comprises the following steps: in the interlocking condition detection process, in response to a starting signal of an action device of the semiconductor process equipment, obtaining a plurality of interlocking lists of the action device, each interlocking list comprises interlocking conditions of one category and target condition values of the interlocking conditions, and under the condition that the target condition values of the interlocking conditions are not matched with the obtained actual condition values, error information of the interlocking conditions is stored according to the categories to which the interlocking conditions belong. A plurality of interlocking conditions of the action device are divided into a plurality of categories, and when the error information of the interlocking conditions is stored according to the categories of the interlocking conditions, in the troubleshooting stage, the troubleshooting range can be narrowed, the fault point can be quickly determined, and the troubleshooting efficiency can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to an interlock condition detection method and semiconductor process equipment. Background technique [0002] In the control of semiconductor process equipment, a plurality of interlock conditions are usually set for the active device. Before the lower computer in the semiconductor process equipment controls the action of the action device, it first detects whether the interlock conditions are satisfied. If there is an unsatisfied interlock condition, the interlock is triggered to prohibit the action of the action device, so as to improve the operation of the semiconductor process equipment. process safety and reliability. [0003] Among them, when the lower computer detects that a certain interlock condition is not satisfied, it can not only trigger the interlock, prohibit the action of the action device, but also record the error information that the interlock con...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G05B19/418
CPCG05B19/41865G05B2219/32252Y02P90/02
Inventor 任娇
Owner XIAN NAURA MICROELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com