Photoresist coating equipment and photoresist coating method
A coating method and glue coating technology, which can be used in photoplate-making process coating equipment, devices for coating liquid on surfaces, coatings, etc., and can solve problems such as uncontrollable thickness of photoresist
Pending Publication Date: 2022-07-01
INST OF MICROELECTRONICS CHINESE ACAD OF SCI +1
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Problems solved by technology
[0010] The purpose of the invention is to at least solve the problem that the photoresist thickness at each position of the wafer surface is uncontrollable in the photoresist coating process
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[0029] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that the present invention will be more thoroughly understood, and will fully convey the scope of the present invention to those skilled in the art.
[0030] It is to be understood that the terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a," "an," and "the" can also be intended to include the plural forms unless the context clearly dictates otherwise. The terms "comprising", "comprising", "containing" and "having" are inclusive and thus indicate the presence of ...
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The invention belongs to the technical field of semiconductor manufacturing equipment, and particularly relates to photoresist coating equipment and a photoresist coating method. The photoresist coating equipment comprises a loading table, at least one spray head, a plurality of piezoelectric units and a controller, the loading table is used for loading a wafer, the spray head is arranged above the loading table, the spray head is provided with a plurality of nozzles facing the loading table, and the nozzles are arranged at intervals in the length direction of the spray head; the plurality of nozzles are communicated with an external photoresist supply unit through a supply pipeline in the spray head, a piezoelectric unit is arranged at any nozzle, the piezoelectric unit is used for controlling the connection and disconnection between the nozzle and the supply pipeline, and the controller is used for controlling the piezoelectric unit so as to control the connection and disconnection between the nozzle and the supply pipeline. According to the photoresist coating equipment, photoresist coating can be carried out on the surface of the wafer on the basis that the wafer does not need to be rotated, accurate control can be carried out according to the coating thickness required by each position of the surface of the wafer, and the coating quality is ensured.
Description
technical field [0001] The application belongs to the technical field of semiconductor manufacturing equipment, and in particular relates to a photoresist coating device and a photoresist coating method. Background technique [0002] The photolithography process is a very important process in the manufacture of semiconductor chips. It transfers the pattern on the mask to the substrate with the help of photoresist (also known as photoresist). Generally, the surface of the substrate is cleaned and dried. Primer coating, photoresist coating, soft bake, alignment exposure, post bake, development, hard bake, etching, inspection and other processes. Among them, photoresist coating is the top priority. Only by uniformly coating a predetermined amount of photoresist on the substrate can a good foundation be laid for the subsequent pattern transfer. [0003] The method of coating photoresist in the existing semiconductor integrated circuit often adopts spin coating method, and the s...
Claims
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Login to View More IPC IPC(8): G03F7/16B05C5/02B05C11/10B05C13/02B05D1/26
CPCG03F7/16B05C5/02B05C11/10B05C13/02B05D1/26
Inventor 崔栽荣丁明正贺晓彬刘强王桂磊白国斌
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI