Heat dissipation device of variable frequency driving module of variable frequency air conditioner

Abstract

The invention belongs to the field of variable frequency air conditioners, and particularly relates to a heat dissipation device of a variable frequency driving module of a variable frequency air conditioner, which comprises a main frame, heat insulation devices are symmetrically arranged at the two ends of the main frame, the two ends of the main frame are fixedly connected with the inner walls of the heat insulation devices, and rubber rings are arranged on the outer surfaces of the heat insulation devices. The bottom of the rubber ring is fixedly connected with the outer surface of the main frame, dustproof devices are evenly arranged at the two ends of the main frame, the inner wall of the main frame is movably connected with the outer surfaces of the dustproof devices, the heat insulation device comprises a heat dissipation copper plate, and supporting columns are evenly arranged at the top of the heat dissipation copper plate. In order to overcome the defects in the prior art, the heat dissipation device of the variable frequency driving module of the variable frequency air conditioner is provided, and the problem that the heat dissipation efficiency is easily reduced due to a traditional heat dissipation device is solved.

Description

technical field [0001] The invention belongs to the field of frequency conversion air conditioners, in particular to a heat dissipation device for a frequency conversion drive module of the frequency conversion air conditioner. Background technique [0002] At present, the drive module chips of inverter air conditioners mostly use refrigerant heat dissipation method. The refrigerant heat dissipation device includes a refrigerant pipe for conveying refrigerant and two heat-conducting plates. The two heat-conducting plates are arranged opposite to each other and sandwich the refrigerant pipe in the middle. One of the heat-conducting plates is fixed on the chip. On the surface, in order to exchange heat between the cooling device and the chip to cool down the chip, heat-dissipating silicone grease is smeared between the refrigerant pipe and the heat-conducting plate to fill the gap between the refrigerant pipe and the heat-conducting plate and improve the heat exchange effect. ...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a cooling device for the variable frequency drive module of the inverter air conditioner, which solves the problem that the traditional cooling device easily leads to a decrease in cooling efficiency

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