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Temperature measurement method, device, system and terminal based on heat conduction

A technology of temperature measurement and thermal conductivity, which is used in measuring devices, thermometers, and heat measurement.

Pending Publication Date: 2022-07-08
孚泽(成都)科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the shortcomings of the prior art described above, the purpose of this application is to provide a temperature measurement method, device, system and terminal based on heat conduction, to solve the temperature measurement method in the prior art. If the measured area is exposed to the temperature measurement environment in the field of view, it will not be possible to perform accurate temperature measurement and other problems

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  • Temperature measurement method, device, system and terminal based on heat conduction
  • Temperature measurement method, device, system and terminal based on heat conduction
  • Temperature measurement method, device, system and terminal based on heat conduction

Examples

Experimental program
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Embodiment 1

[0077] Embodiment 1: A temperature measurement method.

[0078] The exposed surface 1 and the hidden surface 2 of the measured object. The exposed surface 1 of the measured object is evenly provided with a temperature measurement sensor substrate 3 for installing 25 temperature measurement sensors in 5 rows and 5 columns, so as to provide 25 temperature measurement sensors. The sensor is in close contact with the exposed surface and is set corresponding to 25 measurement points;

[0079] The method includes:

[0080] 1. The thermal conduction coefficient Kc and thermal conduction time Tc of the measured object are determined by its material, which can be obtained by calibration measurement and calculation at a given ambient temperature. The method is as follows:

[0081] Apply the boundary temperature T for calibration at the point to be measured on the hidden surface y ;

[0082] Select the temperature sensor with the shortest heat conduction path to the point to be measur...

specific Embodiment

[0096] like figure 2 A schematic structural diagram of a temperature measurement system based on heat conduction in an embodiment of the present invention is shown;

[0097] Applied to DUTs with exposed and hidden surfaces that generate heat, the system includes:

[0098] The temperature measurement array building module 21 is used to obtain a temperature measurement array with a plurality of temperature measurement points based on the setting positions of the temperature measurement sensors on the exposed surface; wherein, the temperature measurement sensors are evenly arranged on the exposed surface ; And each temperature sensor corresponds to a temperature measurement point;

[0099] The statistics module 22 is connected to the temperature measurement array building module 21, and is used to count the temperature change information of each temperature measurement point in the temperature measurement array measured in real time by each temperature measurement sensor; where...

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Abstract

According to the temperature measurement method, device and system based on heat conduction and the terminal, the temperature measurement array with the plurality of temperature measurement points is obtained based on the setting positions of the plurality of temperature measurement sensors on the exposed surface; counting temperature change information of each temperature measurement point in the temperature measurement array measured by each temperature measurement sensor in real time; and obtaining temperature distribution information of the hidden surface according to the temperature change information of each temperature measurement point based on the heat conduction coefficient and the heat conduction time of the measured object obtained through calibration calculation. According to the invention, accurate temperature measurement can be realized without clinging the sensor to the surface of the measured object and exposing the measured object in the field of view.

Description

technical field [0001] The present application relates to the field of temperature measurement, and in particular, to a temperature measurement method, device, system and terminal based on heat conduction. Background technique [0002] Common temperature measurement usually adopts contact and non-contact measurement methods. Among them, the common measurement methods in contact are temperature transmitters, electrical contact thermometers, thermal resistances, bimetal thermometers, thermocouples, etc. Such temperature measurement methods need to be The temperature measurement equipment is in contact with the object to be measured, and the physical changes inside the measurement equipment are converted into mechanical instruments for direct display, or converted into electrical signals for measurement and display; non-contact measurement methods are common optical thermometers, radiation thermometers, Infrared thermometers, etc., such temperature measurement methods do not ne...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K13/00
CPCG01K13/00
Inventor 马春华王宏松
Owner 孚泽(成都)科技有限公司