Probe structure for high-frequency test
A probe and high-frequency technology, which is applied in the field of probe structure for high-frequency testing, can solve problems such as inconsistency and unstable test data, and achieve the effects of eliminating fatigue problems, eliminating small rotation offsets, and improving stability
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Embodiment 1
[0023] Embodiment 1: A probe structure for high-frequency testing, comprising a main body 1, a support plate 2 located below the main body 1, a probe 51 for contacting a chip to be tested, and a moving point contact probe 31, the probe 51 2. The moving point contact probes 31 are respectively installed on both ends of the support plate 2, the middle part of the support plate 2 and the main body 1 are connected by a vertically arranged second elastic member 23, and one side of the lower end surface of the main body 1 is provided with a the static point contact probe 32 above the moving point contact probe 31 and corresponding to the moving point contact probe 31;
[0024] A first pin 9 perpendicular to the length direction of the support plate 2 is mounted on the upper part of the support plate 2 between the probe 51 and the second elastic member 23 through an adapter seat 6 , and is located on the other side of the lower end surface of the main body 1 . A second pin 11 and a t...
Embodiment 2
[0027]Embodiment 2: A probe structure for high-frequency testing, comprising a main body 1, a support plate 2 located below the main body 1, a probe 51 for contacting a chip to be tested, and a moving point contact probe 31, the probe 51 2. The moving point contact probes 31 are respectively installed on both ends of the support plate 2, the middle part of the support plate 2 and the main body 1 are connected by a vertically arranged second elastic member 23, and one side of the lower end surface of the main body 1 is provided with a The static point contact probe 32 above the moving point contact probe 31 and corresponding to the moving point contact probe 31, when the probe is in contact with the chip to be tested, the moving point contact probe rotates away from the static point contact probe with the support plate, and the dynamic and static point contact The probes change from the initial state of mutual contact to the state of mutual separation. After the control system o...
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