Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chip tester

A technology of chip testing and test bench, which is applied in the direction of electronic circuit testing, measuring electronics, measuring devices, etc., can solve problems such as inconsistency and unstable test data, eliminate fatigue problems, eliminate small rotation offsets, and ensure accuracy Effect

Active Publication Date: 2022-02-18
STELIGHT INSTR CO LTD
View PDF7 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Based on the above findings, the purpose of the present invention is to provide a chip testing machine, which solves the instability of test data in the long-term use process caused by the fatigue of the test probe assembly on the machine platform in the prior art , inconsistencies

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip tester
  • Chip tester
  • Chip tester

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Embodiment 1: A chip testing machine, a substrate 21, a test platform 22 installed on the upper surface of the substrate 21, a drive bracket 23 installed on the outside of the substrate 21, and a test probe mounted on the drive bracket 23 and located above the test platform 22 Assembly 24, the test probe assembly 24 includes: a body 1 connected to the drive bracket 23, a support plate 2, a probe 51 for contacting the chip to be tested and a moving point contact probe 31, and one end of the support plate 2 is installed There is a cantilever 4, the other end of which is equipped with the moving point contact probe 31, and one side of the lower end surface of the body 1 is provided with a static point contact probe 32 which is located at the top of the moving point contact probe 31 and corresponds to it, when the probe is in contact with the chip to be tested When in contact, the dynamic point contact probe rotates with the support plate away from the static point contact p...

Embodiment 2

[0035] Embodiment 2: A chip testing machine, a substrate 21, a test bench 22 installed on the upper surface of the substrate 21, a drive bracket 23 installed on the outside of the substrate 21, and a test probe mounted on the drive bracket 23 and positioned above the test bench 22 Assembly 24, the test probe assembly 24 includes: a body 1 connected to the drive bracket 23, a support plate 2, a probe 51 for contacting the chip to be tested and a moving point contact probe 31, and one end of the support plate 2 is installed There is a cantilever 4, the other end of which is equipped with the dynamic point contact probe 31, and one side of the lower end surface of the body 1 is provided with a static point contact probe 32 located on the upper part of the dynamic point contact probe 31 and corresponding to it, and the cantilever 4 is far away from the support plate 2 one end is fixed with a probe holder 5 on which the probe 51 is installed;

[0036] An adapter seat 6 is installed...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a chip testing machine, a substrate, a test platform installed on the upper surface of the substrate, a drive bracket installed on the outside of the substrate, and a test probe assembly installed on the drive bracket and located above the test platform, the test probe assembly It includes: a body connected to the drive bracket, a support plate, a probe for contacting the chip to be tested, and a moving point contact probe. A cantilever is installed on one end of the support plate, and the moving point contact probe is installed on the other end. One side of the lower end surface of the body is provided with a static point contact probe located on the upper part of the dynamic point contact probe and corresponding to the static point contact probe. The end of the cantilever far away from the support plate is fixed with a probe seat on which the probe is installed; on the right side of the first pin shaft The center-of-mass moment of the support plate part, the cantilever, the probe seat and the probe is greater than the center-of-mass moment of the remaining part of the support plate and the moving point contact probe located on the left side of the first pin axis. The invention improves the stability, repeatability, comparability and consistency of detection data.

Description

technical field [0001] The invention relates to a chip testing machine, which belongs to the technical field of chip testing. Background technique [0002] In the production and testing process of lasers in the optical communication industry, before the COC aging process, it is also necessary to conduct a photoelectric performance test of a single laser chip (Laser Diode, LD), so that the performance of the laser chip (LD) can be screened before aging, and the performance Problematic lasers are picked out in advance, thereby improving the overall yield after COC burn-in. [0003] In the testing process of a single laser chip (LD) in optical communication, the stability of the probe plays a very important role. At least it will push the position or angle of the chip to shift. Once the position and angle of the chip change, it will directly affect the stability of subsequent test indicators and test efficiency, and the pressure stability of the test probe will also be directl...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28G01R1/04G01R1/067G01R1/073
CPCG01R31/2886G01R31/2887G01R1/04G01R1/06705
Inventor 黄建军吴永红赵山胡海洋
Owner STELIGHT INSTR CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com