Heat dissipation method of electronic integrated module

A technology of integrated modules and heat dissipation methods, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of unfavorable deep integration and miniaturization of intelligent equipment, poor heat dissipation performance of electronic integrated modules, etc., to improve heat dissipation efficiency and heat dissipation effect. , Improve the heat dissipation effect, reduce the volume effect

Pending Publication Date: 2022-07-15
乐山希尔电子股份有限公司
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  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to solve the above-mentioned problems existing in the prior art. It provides a heat dissipation method for an electronic integrated module. Effectively improve heat dissipation efficiency and heat dissipation effect on the premise of reducing the volume of the vertical heat dissipation structure, and solve the technical problems of poor heat dissipation performance of electronic integrated modules and unfavorable for deep integration and miniaturization of intelligent equipment in the prior art

Method used

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  • Heat dissipation method of electronic integrated module
  • Heat dissipation method of electronic integrated module
  • Heat dissipation method of electronic integrated module

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Embodiment 1

[0036] This embodiment discloses a heat dissipation method for an electronic integrated module. The method mainly uses a combination of lateral conduction heat dissipation and vertical conduction heat dissipation to dissipate heat to the electronic integrated module 7, which can reduce the volume of the vertical heat dissipation structure under the premise of reducing heat dissipation. Effectively improve heat dissipation efficiency and heat dissipation effect. It should be noted that the lateral heat dissipation refers to using a circulating cooling medium to laterally exchange part of the heat to another heat dissipation area for heat dissipation, so as to achieve the purpose of increasing the heat exchange rate and the heat transfer efficiency.

[0037] Specifically, the heat dissipation method includes the following steps:

[0038] Step A: First set the vertical radiator 4 and the lateral auxiliary radiator 3, and preferably the volume of the lateral auxiliary radiator 3 i...

Embodiment 2

[0046] This embodiment verifies the method described in Embodiment 1, as follows:

[0047] In this embodiment, a 50A IPM product is used as an example, and the temperature of the electronic integrated module 7 is actually measured to be 120° C. when the ordinary radiator is energized at 50A according to the background art. 96°C, the temperature has decreased by 24°C, a decrease of about 20%.

[0048] Compared with the temperature reduction of 18° C. in the patent documents cited in the background art, the temperature reduction of the present invention is larger. Furthermore, because the present invention also enables the volume of the vertical radiator 4 to be reduced to match the volume of the electronic integrated module 7, the volume of the intelligent equipment can also be effectively reduced, and the effect of the present invention is also better.

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Abstract

The invention discloses a heat dissipation method of an electronic integrated module, which comprises the following steps of: A, respectively connecting a transverse auxiliary radiator and a vertical radiator by using a transverse circulating heat exchange assembly in which a cooling medium is arranged, and installing the electronic integrated module on the vertical radiator; b, a cooling medium is controlled to flow circularly, heat generated by the electronic integration module is continuously dissipated in a vertical heat dissipation mode through a vertical heat dissipation device, and meanwhile heat exchange is continuously conducted between the heat generated by the electronic integration module and the cooling medium flowing circularly; the cooling medium after heat absorption circularly flows to the transverse auxiliary radiator, and the heat is transversely conducted to the transverse auxiliary radiator for heat dissipation; and repeating the steps until the heat dissipation of the electronic integrated module is completed. According to the method, heat dissipation is carried out on the electronic integration module in a mode of combining transverse conduction heat dissipation and vertical conduction heat dissipation, and the technical problems that in the prior art, the heat dissipation performance is poor, and deep integration of intelligent equipment is not facilitated are solved.

Description

technical field [0001] The invention belongs to the technical field of electronic heat dissipation, and particularly relates to a heat dissipation method for an electronic integrated module. Background technique [0002] At present, all walks of life are moving in the direction of intelligence. And with the rapid development of science and technology, there are more and more types of intelligent equipment. But no matter what kind of intelligent equipment, it is inseparable from the electronic components that play the core control role. For the current intelligent equipment, it is usually necessary to integrate various electronic components into a whole electronic integrated module, and the integration degree of the electronic integrated module largely determines the structure and volume of the intelligent equipment. For example, the higher the integration degree of the electronic integrated module, the more precise the structure of the intelligent equipment, the smaller th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20354H05K7/2039
Inventor 邓华鲜
Owner 乐山希尔电子股份有限公司
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