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Operation method and operation device of failure detection and classification model

A classification model, type of technology, applied in error detection/correction, character and pattern recognition, instruments, etc., can solve problems such as large manpower, inaccurate craftsmanship, and cost

Pending Publication Date: 2022-07-19
UNITED MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method must consume a considerable amount of manpower
Moreover, with the increase in product complexity and process precision, there are more and more cases where the analysis model needs to be adjusted or further retrained. If the analysis model cannot be corrected immediately, the process cannot be accurately monitored.

Method used

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  • Operation method and operation device of failure detection and classification model
  • Operation method and operation device of failure detection and classification model
  • Operation method and operation device of failure detection and classification model

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Embodiment Construction

[0014] Please refer to figure 1 , which shows a schematic diagram of process monitoring according to an embodiment. In the semiconductor process, various processes, such as deposition, etching, annealing, etc., are performed on the wafer using various semiconductor tools 900 . A sensor 910 is provided on the semiconductor machine 900 to sense pressure, temperature, concentration and other values. The sensor 910 usually performs continuous sensing to obtain a raw trace RT. The detection curve RT can be transmitted to the remote operating device 100 through the network 800 . The operation device 100 is, for example, a computer, a server, a cluster computing center or an edge computing center. The operating device 100 may input the detection curve RT into a fault detection and classification model (FDC model) MD to output a prediction result RS. The prediction result RS is, for example, a process yield prediction for prediction and health management (Prognostics and Health Ma...

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Abstract

The invention relates to an operation method and an operation device of a failure detection and classification model. The operation method of the failure detection and classification model comprises the following steps. And continuously obtaining a plurality of detection curve graphs. Judging whether the detection curve graphs are changed from a first waveform to a second waveform or not; if the detection curve graphs are changed from the first waveform to the second waveform, judging whether at least N of the detection curve graphs are changed to the second waveform or not; if at least N detection curve graphs are changed into second waveforms, the detection curve graphs changed into the second waveforms are automatically cut to obtain a plurality of windows. An algorithm is automatically set for each window. Obtaining index data of each window through each algorithm; and retraining the failure detection and classification model according to the index data.

Description

technical field [0001] The present invention relates to an operation method and an operation device, and in particular, to an operation method and an operation device of a failure detection and classification model. Background technique [0002] With the rapid development of semiconductor technology, the complexity and precision of the process continue to increase. In the semiconductor process, after various detection information of the process equipment is analyzed, prediction and health management (Prognostic and Health Management, PHM) or virtual measurement (Virtual.Metrology, VM) can be performed through the analysis model. If it is found that the forecast information or measurement information of the process equipment is not ideal, it needs to be adjusted as soon as possible to avoid a large number of defective products. [0003] Humans have traditionally been used to monitor whether analytical models need to be adjusted or retrained with new datasets. However, this ...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/3308G06F119/02
CPCG06F30/3308G06F2119/02G06F11/322G06F11/348G06F11/3075G06F2218/12G06F18/28G06F18/217G06F18/214G05B23/024G05B2219/24085
Inventor 林京沛龚吉富陈德轩洪逸琳
Owner UNITED MICROELECTRONICS CORP