Plastic package diode with good heat dissipation and diode chip protection
A technology for protecting diodes and diodes, which is applied in the field of diodes, can solve the problems that the heat of diode chips cannot be dissipated, the service life of diode chips is reduced, and the protection effect of diode chips is poor, so as to achieve the effects of simple structure, extended service life and convenient installation
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[0025] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0026] see Figure 1-4 , the embodiment of the present invention provides a technical solution: a plastic-encapsulated diode with good heat dissipation and protection of the diode chip, comprising a base 1, the top of the base 1 is provided with a top seat 4, the edge of the top of the base 1 is provided with a bump 10, the top The edge of the bottom of the seat 4 is provided with grooves 12 to facilitate the position limit. The two e...
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