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Plastic package diode with good heat dissipation and diode chip protection

A technology for protecting diodes and diodes, which is applied in the field of diodes, can solve the problems that the heat of diode chips cannot be dissipated, the service life of diode chips is reduced, and the protection effect of diode chips is poor, so as to achieve the effects of simple structure, extended service life and convenient installation

Pending Publication Date: 2022-07-26
江苏固得沃克微电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a plastic-encapsulated diode with good heat dissipation and protection of the diode chip, which solves the problem that the existing plastic-encapsulated diode has a poor heat dissipation effect during use, which causes the heat emitted by the diode chip to be unable to dissipate, and thus is easy to The service life of the diode chip is reduced; most of the existing plastic-encapsulated diodes are cumbersome and inconvenient to operate when they are assembled and stored, which makes the practicability poor; most of the existing plastic-encapsulated diodes do not protect the diode chip well, and are easily affected by external forces. The problem that the collision causes its damage, which makes the protection effect of the diode chip poor

Method used

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  • Plastic package diode with good heat dissipation and diode chip protection
  • Plastic package diode with good heat dissipation and diode chip protection
  • Plastic package diode with good heat dissipation and diode chip protection

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Embodiment Construction

[0025] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0026] see Figure 1-4 , the embodiment of the present invention provides a technical solution: a plastic-encapsulated diode with good heat dissipation and protection of the diode chip, comprising a base 1, the top of the base 1 is provided with a top seat 4, the edge of the top of the base 1 is provided with a bump 10, the top The edge of the bottom of the seat 4 is provided with grooves 12 to facilitate the position limit. The two e...

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Abstract

The invention discloses a plastic package diode with good heat dissipation and diode chip protection, which comprises a base, the top of the base is provided with a top seat, the edge of the top of the base is provided with a convex block, the edge of the bottom of the top seat is provided with a groove, and the bottoms of the two ends and the two sides of the top seat are provided with a plurality of groups of positioning grooves. Fixing assemblies are arranged at the tops of the two ends and the two sides of the base, mounting holes are formed in one side of the bottom of the base and one side of the top of the top base, and heat dissipation columns are arranged on the inner sides of the mounting holes; according to the invention, through mutual cooperation between the heat-conducting fin and the heat dissipation column, heat emitted by the diode chip can be conducted to the heat dissipation column through the heat-conducting fin to be discharged during working, and meanwhile, the heat is conveniently and rapidly dissipated through the hollow structure of the heat dissipation column, so that the diode has a stronger heat dissipation effect, and the service life of the diode is prolonged. Therefore, the heat dissipation efficiency is improved, and the service life of the diode chip is prolonged.

Description

technical field [0001] The invention relates to the technical field of diodes, in particular to a plastic-encapsulated diode with good heat dissipation and protection of diode chips. Background technique [0002] A diode is an electronic device made of semiconductor materials (silicon, selenium, germanium, etc.), which has unidirectional conductivity, that is, when a forward voltage is applied to the anode and cathode of the diode, the diode is turned on, and when the anode and cathode are applied to the diode, the diode is turned on. When the reverse voltage is applied, the diode is turned off. Therefore, the on and off of the diode is equivalent to the on and off of the switch. The diode is one of the earliest semiconductor devices, and its application is very wide; especially in various In electronic circuits, diodes, resistors, capacitors, inductors and other components are reasonably connected to form circuits with different functions, which can realize rectification of...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/31H01L23/16H01L29/861
CPCH01L23/3672H01L23/3121H01L23/16H01L29/861
Inventor 苏荻楠
Owner 江苏固得沃克微电子科技有限公司
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