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Semiconductor structure

A technology of semiconductor and interconnect structure, applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problem of not using large-sized substrates

Pending Publication Date: 2022-07-29
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the substrate RDL wiring is evenly distributed on each layer. If there is no solution to the problem of disconnected RDL wiring using partition technology, this technology will not be applied to large-size substrate design.

Method used

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  • Semiconductor structure
  • Semiconductor structure
  • Semiconductor structure

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Embodiment Construction

[0020] The following disclosure provides many different embodiments or examples for implementing different features of the presented subject matter. Specific examples of elements and arrangements are described below to simplify the present disclosure. Of course these are merely examples and are not intended to limit the invention. For example, in the following description, forming a first part over or on a second part may include embodiments in which the first part and the second part are in direct contact, and may also include forming additional parts between the first part and the second part Embodiments such that the first part and the second part may not be in direct contact. Furthermore, the present disclosure may repeat reference numerals and / or letters in various instances. This repetition is for brevity and clarity only and does not in itself represent a relationship between the various embodiments and / or configurations discussed.

[0021] figure 2 is a cross-sect...

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Abstract

A semiconductor structure includes a first substrate and a second substrate adjacent to the first substrate, a first side of the first substrate having a first interconnect structure, the second substrate having a second side opposite the first side, the second side having a second interconnect structure. The semiconductor structure also includes a connection region including a first interconnect structure and a second interconnect structure. The first interconnection structure and the second interconnection structure are electrically connected to the upper surface of the connection area.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, and more particularly, to a semiconductor structure. Background technique [0002] After the large-size substrate is cut into small sizes using the partition technology, the signals that communicate with each other in the original large-size substrate are disconnected and cannot be connected in series. Therefore, it must be redesigned through RDL (Redistribution layer, redistribution layer). like figure 1 As shown in the figure, the wiring of the RDL 12 is currently based on the final number of I / Os. The wiring is uniformly distributed across each layer. Using the partition technology to cut the original large-size substrate 10, all the RDL 12 of each layer can only be laid out. To the top layer and then cascade, to maintain the original design function. [0003] At present, the RDL wiring of the substrate is evenly distributed in each layer. If there is no solution to the probl...

Claims

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Application Information

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IPC IPC(8): H01L23/48H01L23/498
CPCH01L23/481H01L23/49838
Inventor 黄文宏
Owner ADVANCED SEMICON ENG INC