Guide device of semiconductor packaging frame and metal filing removal method

Abstract

The invention discloses a guiding device of a semiconductor packaging frame and a metal filing removing method, a left flow channel and a right flow channel are laid on the left side and the right side in the running direction of the frame, the upper portion of the left flow channel and the upper portion of the right flow channel are respectively provided with a U-shaped groove, and the opening of the U-shaped groove in the upper portion of the left flow channel is opposite to the opening of the U-shaped groove in the upper portion of the right flow channel; collecting grooves with upward openings are respectively formed in the lower parts of the left flow channel and the right flow channel; the upper portion of the inner side edge of the collecting groove is connected with the lower portion of an opening of the U-shaped groove of the left flow channel or the right flow channel, a notch used for being spliced with the collecting box is formed in the end, located in the left flow channel or the right flow channel, of the collecting groove, the end, facing the collecting box, of the inner bottom face of the collecting groove inclines downwards, and the lowest position is higher than the inner bottom face of the collecting box. Metal filings falling from the frame are automatically collected, the frame can be prevented from sliding out of a rail easily during stepping, equipment runs stably, and the production efficiency, the product quality and the equipment utilization efficiency are greatly improved; the device is simple in structure, stable, efficient and low in manufacturing cost.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and in particular relates to a guiding device for a semiconductor packaging frame and a method for removing metal chips. Background technique [0002] In the semiconductor packaging process, the frame has to pass through the rails in each process, and there are burrs on the frame. When the machine is running, high-frequency vibration produces friction, so that metal chips and burrs fall everywhere, and it is easy to cause damage to the product. Product quality problems, falling into the machine will cause a short circuit of the machine, affecting production efficiency, product quality and equipment utilization efficiency. [0003] In addition, the surface of the guide structure of the current frame stepping is smooth and free of obstructions, and when the frame is stepping, it is easy to slip out of the track, resulting in jamming and scrapping. SUMMARY OF THE INVENTION [0004...

AI Technical Summary

Problems solved by technology

[0002] In the semiconductor packaging process, the frame has to pass through the track in each process, and there are burrs on the frame. When the machine is running, high-frequency vibration generates friction, so that metal shavings and burrs fall everywhere, and it is easy to cause damage when falling on the product. Product quality problems, falling into the machine will cause short circuit of the machine, affecting production efficiency, product quality and equipment utilization efficiency

[0003] In addition, the guide structure of the current frame stepping has a smooth surface and no obstructions. When the frame is stepping, it is easy to slip out of the track, resulting in material jams and scrapping

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