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Multipurpose chip testing device and chip testing method

A chip testing, multi-purpose technology, applied in the direction of measuring devices, workpiece clamping devices, electronic circuit testing, etc., can solve the problems of not being able to meet different sizes of chips, low pin test efficiency, and affecting test quality, etc., to achieve pin High test efficiency, high test efficiency, convenient and quick operation

Pending Publication Date: 2022-08-09
江苏海纳电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that chip testing devices are often used in the prior art. The existing chip testing devices cannot meet the requirements for testing chips of different sizes. Each size of chip testing has an independent testing device. , the quality test has a single test, is not comprehensive enough to affect the test quality, and has the shortcomings of low pin test efficiency, and proposes a multi-purpose chip test device and chip test method

Method used

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  • Multipurpose chip testing device and chip testing method
  • Multipurpose chip testing device and chip testing method
  • Multipurpose chip testing device and chip testing method

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Embodiment Construction

[0040] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments.

[0041] refer to Figure 1-5 , a multipurpose chip testing device, comprising,

[0042] The quality inspection table 1, the top side of the quality inspection table 1 is provided with a spacing adjustment device;

[0043] The baffle A2, the baffle A2 is detachably connected to the top side of the quality inspection table 1 through a buckle;

[0044] Conveyor belt A3, the conveyor belt A3 is embedded in the top side of the quality inspection table 1;

[0045] Gantry A4, the gantry A4 is detachably connected to the top side of the quality inspection platform 1 through bolts;

[0046] A multi-angle quality inspection device is fixed on one s...

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Abstract

The invention relates to the technical field of chip testing, in particular to a multipurpose chip testing device which comprises a quality detection table, a distance adjusting device is arranged on the top side of the quality detection table, a baffle A is detachably connected to the top side of the quality detection table through a buckle, a conveying belt A is embedded in the top side of the quality detection table, and the distance adjusting device is arranged on the top side of the quality detection table. The portal frame A is detachably connected to the top side of the quality detection table through bolts, the conveying table is arranged on one side of the quality detection table, the baffle B is fixedly connected to the top side of the conveying table, the pin detection table is arranged on one side of the conveying table, a second defective product collecting device is arranged on one side of the pin detection table, and the conveying belt B is embedded in the top side of the pin detection table. The portal frame B is fixedly connected to the top side of the pin detection table, the control table is arranged on one side of the quality detection table, the display screen is electrically connected to the top side of the control table through a wire, and the multipurpose chip testing device is convenient and rapid to operate, suitable for testing chips of different sizes, high in quality testing quality and high in pin testing efficiency.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to a multipurpose chip testing device and a chip testing method. Background technique [0002] Chip is also called integrated circuit English: integrated circuit, abbreviated as IC; Also includes passive components, etc.) are miniaturized and are often fabricated on the surface of semiconductor wafers. [0003] System-level chip testing in the early stage of design, the foundation of SoC is deep sub-micron process, therefore, the testing of Soc devices needs to adopt a new method. Since each functional element has its own test requirements, design engineers must make test planning early in the design process. [0004] Chip testing often uses chip testing equipment. The existing chip testing equipment cannot meet the use of different sizes of chips for testing. Each size chip test has an independent testing equipment. The quality test is single and not comprehensive enough to ...

Claims

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Application Information

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IPC IPC(8): G01N21/95G01N21/88G01N21/84G01R31/28G01R1/067B25B11/00
CPCG01N21/9501G01N21/8851G01R31/2851G01R31/2887G01R1/067B25B11/00G01N2021/8411
Inventor 王琦姜豪
Owner 江苏海纳电子科技有限公司