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Electroplating power supply unit

A technology of a power supply device and a switching device, which is applied to the output power conversion device, electrical components, electrolysis process, etc., can solve the problems of high cost and increased cost of the power supply device.

Inactive Publication Date: 2005-05-18
SANSHA ELECTRIC MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, such IGBTs are not widely available, so they are very expensive, resulting in an increase in the cost of the power supply unit

Method used

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  • Electroplating power supply unit
  • Electroplating power supply unit
  • Electroplating power supply unit

Examples

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Embodiment Construction

[0033] An electroplating power supply unit for a preferred embodiment of the present invention is shown in FIG. 3 . The electroplating power supply unit includes input terminals, such as terminals 30a, 30b and 30c, which are adapted to be connected to a mains alternating current, such as a three-phase mains alternating current. The municipal AC power supplies, for example, "200V set" voltages (ie voltages ranging from 180V-240V) or "400V set" voltages (ie voltages ranging from 380V-460V).

[0034] The input terminals 30a-30c are connected to an input rectifier 32 which is a full wave rectification circuit including rectification diodes 32a, 32b, 32c, 32d, 32e and 32f. An output of the input rectifier 32 is connected to a series combination of two filter capacitors 36a and 36b through a parallel combination of a thyristor 34a and a resistor 34b.

[0035] A DC-to-high frequency converter consisting of inverters 38a and 38b, respectively, is connected in parallel with smoothing ...

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Abstract

A power supply unit for electroplating includes an input rectifier (32). The output of the rectifier is converted to a high frequency signal in an inverter (38a, 38b), which is transformed in a transformer (48a, 48b). When the transformed high-frequency signals are positive, they are rectified by the diode (50a or 50b) so that the positive current is supplied to the load (60), and when they are negative, they are rectified by the diode (50c or 50d) so that the negative current flows overload. A first IGBT (54a) is connected in series to each of the diodes (50a, 50b) and becomes conductive and non-conductive at a frequency lower than a high frequency signal. A second IGBT (54b) is also connected in series with each of the diodes (50c, 50d), and when the first IGBT is conducting, the second IGBT is not conducting and vice versa. The inverters (38a, 38b) are controlled synchronously with the first and second IGBTs (54a, 54b).

Description

technical field [0001] The present invention relates to a power supply device for electroplating, which supplies electric current to a load including an object to be plated, an electrolytic solution and electrodes, to thereby electroplate the object. (In this paper, this power supply refers to the electroplating power supply, and the load refers to the electroplating load). Background technique [0002] In electroplating, it is known that the polarity of the current supplied to the electroplating load is reversed extremely rapidly. Plating occurs when a positive current is supplied to the plating load; and when a negative current is supplied to the load, the plating is interrupted or part of the metal forming the plating layer is decomposed into an electrolyte, whereby crystals forming the plating layer are produced Finer so that the object can be evenly plated. [0003] Dangru figure 1 When the multilayer printed circuit board 2 shown is electroplated, some problems can ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D21/00C25D21/12H02M3/28H02M5/22H02M7/00
CPCH02M3/28H02M5/225H02M7/48H02M1/007H02M1/0077H02M1/0087
Inventor 荒井亨樱田诚西冈吉行
Owner SANSHA ELECTRIC MFG
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