Substrate processing devices

A substrate processing device and substrate technology, applied in thin material processing, transportation and packaging, optics, etc., can solve the problems that cannot be eliminated, cannot be uniformly attached by etching liquid, and cannot completely avoid stains, so as to prevent liquid from scattering and solve equipment problems. Etching problem, effect of preventing drying

Inactive Publication Date: 2006-01-25
SUMITOMO PRECISION PROD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, even with such backside spraying, stains caused by local corrosion on the backside cannot be completely avoided.
This is because the transfer rollers, etc. become obstacles in the backside shower, and the etchant cannot be uniformly attached.
In addition, at the beginning of the spray process, the portion where the fine droplets of the etchant hit becomes uneven, which cannot be eliminated even by the subsequent spray process, and fine stains remain after etching.

Method used

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Examples

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Embodiment Construction

[0023] Embodiments of the present invention will be described below with reference to the drawings. figure 1 is a plan view showing a substrate processing apparatus according to an embodiment of the present invention, figure 2 is a side view of the main part of the substrate processing apparatus, image 3 It is a longitudinal sectional side view of the soaking tank and its vicinity arranged in the main part, Figure 4 is along image 3 Schematic diagram of the A-A line arrows.

[0024] The substrate processing apparatus of this embodiment is used for wet processing using a hydrofluoric acid-based etchant to form contact holes in a glass substrate 100 (hereinafter simply referred to as substrate 100 ) of a liquid crystal display device made of low-temperature polysilicon. like figure 1 As shown, the substrate processing apparatus adopts a linear first conveying line A, a second conveying line B connected at right angles to the first conveying line A, and a second conveying...

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PUM

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Abstract

The present invention relates to a substrate processing device, the device can prevent the reverse surface of a substrate from being stained due to local corrosion when the substrate which corrodes with liquid chemicals such as an etchant and peeling liquid is used. A dip tank (37) is provided at the entrance part of a liquid chemical processing part. The dip tank (37) is arranged below a conveyance line for the substrate (100), and the liquid chemicals are made to overflow to be brought into contact with the reverse surface of the substrate (100) to the overall width. When the reverse surface of the substrate (100) becomes temporarily and uniformly wet due to its coming into contact with the liquid chemicals, the substrate is not stained on condition that the reverse surface does not become dry even if the liquid chemicals stick locally on the reverse surface of the substrate (100) as long as the liquid chemicals flow around or a conveyance roller comes into contact.

Description

technical field [0001] The present invention relates to a substrate processing apparatus of a horizontal transfer type used in the manufacture of glass substrates of liquid crystal display devices and the like. Background technique [0002] A glass substrate used for a liquid crystal display device is manufactured by repeatedly performing chemical treatments such as etching and peeling on the surface of a glass substrate as a material. The processing device is roughly divided into dry type and wet type, and wet type is further divided into batch type and blade type. Furthermore, the blade type is subdivided into transmission types such as rotary type and roller transmission. [0003] Among these substrate processing apparatuses, transfer type apparatuses have a basic structure of conveying a substrate approximately horizontally while supplying a processing liquid to the surface of the substrate, and have been conventionally used for etching processing and peeling processing...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/1333H01L21/306G02F1/13G03F7/26H01L21/00H01L21/31
CPCG02F1/13H01L21/02057H01L21/306H01L21/67051Y10S414/14
Inventor 菅长大辅井上浩一星辰也近藤友喜
Owner SUMITOMO PRECISION PROD CO LTD
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