Substrate processing method and substrate processing apparatus

Abstract

The invention provides a method capable of suppressing liquid splash at the circumferential edge of a substrate, and preventing liquid droplets due to liquid splash from adhering to the substrate again when moving a discharge nozzle for scanning while discharging a cleaning solution from the discharge nozzle to the surface of the substrate to make spin drying of the substrate. When a substrate W is held in a horizontal posture by a spin chuck 10 and rotated about a vertical axis with a rotation motor 14, while discharging the cleaning solution onto the surface of the substrate from an outlet of a de-ionized water discharge nozzle 20, the rotation speed of the substrate is decreased in a process that the outlet of the discharge nozzle is traveled from a position opposed to a center of the substrate to a position opposed to the circumferential edge of the substrate.

Description

technical field [0001] The invention relates to a substrate processing method and a substrate processing device, which rotate substrates such as semiconductor wafers, glass substrates for liquid crystal display devices, glass substrates for photomasks, and substrates for optical discs around a vertical axis in a horizontal plane, and rotate toward the surface of the substrate While supplying a cleaning solution such as pure water, the substrate is dried. Background technique [0002] In the manufacturing process of semiconductor devices, circuit patterns are formed on the resist film on the substrate through the following steps: using photolithography technology, for example, coating a photoresist film on a silicon substrate; The instrument prints circuit patterns on the resist film on the substrate; develops the exposed resist film with a developer. Among them, in the developing process, for example, a developing solution is supplied to the exposed resist film formed on th...

AI Technical Summary

Problems solved by technology

[0005] In the above-mentioned scanning rinse, compared with the conventional spin drying, although the development defects can be greatly reduced, the occurrence of development defects cannot be eliminated.

That is, in the scanning rinse, the cleaning liquid is ejected from the discharge port of the cleaning liquid discharge nozzle and the discharge port is moved from the center portion of the substrate to the peripheral portion. The peripheral speed increases toward the peripheral part, so splashing of the cleaning liquid ejected from the ejection nozzle to the substrate is easy to occur

Therefore, there is a problem that the liquid droplets generated by the splashing of the liquid are scattered and attached to the surface closer to the center than the discharge nozzle moving from the center to the periphery of the substrate, and development defects occur due to the droplets.

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