Honey fennel cake
A technology of fennel and honey, applied in the field of honey fennel, can solve the problems of high sweetness, no fennel and oil cakes, unsuitable health food, etc., and achieves the effects of moderate sweetness, unique formula and clear nutritional ingredients.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0009] Take 5000 grams of refined flour, 1750 grams of honey, 1000 grams of osmanthus sugar, 1750 grams of white sugar, 250 grams of bee pollen, 250 grams of royal jelly, 100 grams of cumin, 1000 grams of shelled white sesame seeds, 100 grams of star anise, 100 grams of baking soda, Wait for 2000 grams of pure tea oil to mix and prepare the stuffing core material, beat the mixed and kneaded stuffing core material repeatedly until soft, knead it into balls of the same size by hand, and then take the foreskin prepared by mixing flour, caramel, and tea oil. Wrap the stuffing core tightly, then put it into the cake mold and beat it into shape, take it out and put it in the iron basin, and put the iron basin in the electric oven for baking, the baking temperature is 120 degrees, and the baking time is 20 minutes. Bake the cake until the skin is layered and golden brown, take it out and brush the surface with oil while it is hot, pack it separately after cooling, and make 350 honey f...
Embodiment 2
[0011] Take 5000 grams of refined flour, 3000 grams of honey, 100 grams of bee pollen, 50 grams of royal jelly, 500 grams of sugar, 100 grams of cumin, 100 grams of shelled white sesame seeds, 2000 grams of osmanthus sugar, 100 grams of star anise, 100 grams of baking soda, Wait for 1000 grams of pure tea oil, process by the method of embodiment 1, make 350 honey fennel cakes.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com