Method and equipment for quantitatively distributing adhesion agent onto heat radiator fin, and positioning adhesion therefor
A technology of heat sinks and adhesives, which is applied to devices, coatings, electrical components, etc. that apply liquid to the surface, which can solve the problems of pollution, slow bonding process, position displacement, etc.
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[0019] refer to image 3 , 4 , 5 and 6, the method of quantitatively coating the heat sink 1 with the adhesive 2 and positioning and pasting it on the chip 31 of the circuit board 3 in a preferred embodiment of the present invention includes the following steps:
[0020] Step (1) is to place a plurality of cooling fins 1 with an adhesive surface 10 facing upwards, and arrange them in a tiled manner in a plurality of accommodating spaces 44 of a first positioning tool 4 . The first positioning tool 4 is in the shape of a rectangular plate with a top plane 43, and the accommodating space 44 is formed by recessing downwards on the top plane 43, and the size of each accommodating space 44 is the same as The shape and thickness of the heat sink 1 correspond to accommodate the heat sink 1. In this embodiment, after the heat sink 1 is placed in the accommodating space 44, its adhesive surface 10 is flush with the top plane 43, and A receiving slot 42 is provided between adjacent rec...
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