Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Cooling structure of communication device

A technology of machines and communication circuits, applied in cooling/ventilation/heating renovation, electrical equipment structural parts, electrical components, etc., can solve problems such as inability to guarantee electrical characteristics

Inactive Publication Date: 2006-12-13
MITSUBISHI ELECTRIC CORP
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] Even in such a configuration, the heat generated by the heating element 1 can be released through the shielding plate 3, but in this prior art example, since the metal material is installed near the semiconductor component, there is a problem that the electrical characteristics cannot be guaranteed, and the use of The problem that the L-shaped metal body cannot sufficiently diffuse the heat in the 3 planes of the shielding plate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cooling structure of communication device
  • Cooling structure of communication device
  • Cooling structure of communication device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Fig. 1 is a cross-sectional configuration diagram showing the main configuration of a portable communication device according to Embodiment 1 of the present invention. In this figure, 1 is a heat generating element (hereafter referred to as a heat generating element), 2 is a printed circuit board on which a communication circuit having a heat generating element 1 is mounted, and 3 is a circuit board for suppressing the incidence of noise caused by electromagnetic waves from the outside, covering communication The resin shielding case 4 of the circuit is a housing for accommodating the shielding case 3 and the printed circuit board 2 . 5 is a heat dissipation fin (thermal diffusion member) installed along the inner wall of the shield box 3 for thermal diffusion in the surface direction. As the material of the heat sink 5, in addition to metal sheets with high thermal conductivity, such as Al (thermal conductivity: 236W / mK) and copper (thermal conductivity: 403W / mK), it i...

Embodiment 2

[0064] Fig. 2 is a cross-sectional configuration diagram showing the main configuration of a portable communication device according to Embodiment 2 of the present invention, and Fig. 3 is a cross-sectional configuration diagram showing the main configuration of another portable communication device according to Embodiment 2 of the present invention. 2 is an example of ensuring an air layer as the heat insulating layer 6, and FIG. 3 is an example of providing a foam material 26 as the heat insulating layer 6.

[0065] In the 2nd figure, among the 3rd figure, 27 is an air layer. In Embodiment 2, no thermally conductive sheet 7 is provided between the heat sink 5 and the heating element 1 , and an air layer 27 is formed between the heat sink 5 and the heat generating element 1 . When the calorific value of the heating element 1 is small, as long as the heat sink 5 is installed on the inner wall of the shielding box 2, the temperature of the heating element can be fully reduced b...

Embodiment 3

[0068] Fig. 4 is a cross-sectional configuration diagram showing the main configuration of a portable communication device according to Embodiment 3 of the present invention. In this figure, 33 is a metal shielding box. In this embodiment, the shielding box is made of metal material, so that the metal shielding box 33 has the function of the heat sink 5 in the first embodiment. The thermal conductive sheet 7 is installed between the heating element 1 and the inner wall of the metal shielding box, and the air layer 6 is between the metal shielding box 33 and the housing 4 .

[0069] By doing so, the same effect as that of the first embodiment is obtained, and since the attachment of the heat sink can be omitted, the effect of reducing the assembly cost can be obtained.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thermal conductivityaaaaaaaaaa
Thermal conductivityaaaaaaaaaa
Thicknessaaaaaaaaaa
Login to View More

Abstract

According to the prior art, it is difficult to efficienly cool hot components mounted on a printed-circuit board as well as the surface of the case of a communication device. To solve this problem, a communication device of this invention comprises a communication circuit including hot components mounted on a printed-circuit board; a shield case covering the communication circuit to isolate it from external electromagnetic radiation; a case enclosing the shield case and the printed-circuit board; a material spread along the inner wall of the shield case to diffuse heat in both directions; and a heat-insulating layer provided between the shield case and the inner wall of the case.

Description

technical field [0001] The present invention relates to a communication device, and specifically relates to a heat dissipation structure for dissipating heat generated by an exothermic element arranged in a housing. Background technique [0002] Conventional electronic devices such as portable communication devices have a heat dissipation function for dissipating heat generated by built-in heat generating elements, as shown in FIG. 17, for example. FIG. 17 is a cross-sectional view showing the main structure of a conventional portable communication device shown in Japanese Patent Publication No. 11-204970 published in 2011. In this figure, 1 is a heat generating element (hereinafter referred to as a heat generating element), 2 is a printed circuit board on which a communication circuit having a heat generating element 1 is mounted, 4 is a case for storing the above printed circuit board 2, and 10 is a heat sink. . [0003] The thermal conductivity of air is very small at 0...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K7/20H05K9/00
CPCH05K7/20445H05K9/0024H05K9/0026
Inventor 下地美保子尾崎永一中尾一成大串哲朗平尾康一长谷川学小林孝吉沢二郎
Owner MITSUBISHI ELECTRIC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com