Cooling structure of communication device

A technology of machines and communication circuits, applied in cooling/ventilation/heating renovation, electrical equipment structural parts, electrical components, etc., can solve problems such as inability to guarantee electrical characteristics

Inactive Publication Date: 2006-12-13
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] Even in such a configuration, the heat generated by the heating element 1 can be released through the shielding plate 3, but in this prior art example, since the metal material is installed near the semiconductor

Method used

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  • Cooling structure of communication device
  • Cooling structure of communication device
  • Cooling structure of communication device

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0025] Example 1

[0026] Fig. 1 is a cross-sectional configuration diagram showing the main configuration of a portable communication device according to Embodiment 1 of the present invention. In the figure, 1 is a heating element (hereinafter referred to as heating element), 2 is a printed circuit board on which a communication circuit with heating element 1 is mounted, and 3 is used to suppress the incidence of noise caused by external electromagnetic waves and cover communication The resin shielding case 4 of the circuit is a housing that houses the shielding case 3 and the printed circuit board 2. 5 is a heat dissipating fin (heat diffusion member) installed along the inner wall of the shielding box 3 for heat diffusion in the surface direction. As the material for the heat sink 5, in addition to metal sheets with high thermal conductivity, such as Al (thermal conductivity: 236W / mK) and copper (thermal conductivity: 403W / mK), a thickness of 0.02 to 0.1 mm can also be used. Left...

Example Embodiment

[0063] Example 2

[0064] Figure 2 is a cross-sectional configuration diagram showing the main configuration of a portable communication device according to Embodiment 2 of the present invention, and Figure 3 is a cross-sectional configuration diagram showing the main configuration of another portable communication device according to Embodiment 2 of the present invention. FIG. 2 is an example in which an air layer is secured as the heat insulating layer 6, and FIG. 3 is an example in which a foam material 26 is provided as the heat insulating layer 6.

[0065] In Figures 2 and 3, 27 is an air layer. In the second embodiment, the thermal conductive sheet 7 is not provided between the heat sink 5 and the heating element 1, and an air layer 27 is provided between the heat sink 5 and the heating element 1. When the calorific value of the heating element 1 is small, as long as the heat sink 5 is installed on the inner wall of the shielding box 2, the temperature of the heating element...

Example Embodiment

[0067] Example 3

[0068] Fig. 4 is a cross-sectional configuration diagram showing the main configuration of a portable communication device according to Embodiment 3 of the present invention. In this figure, 33 is a metal shield box. In this embodiment, the shielding box is made of metal materials, so that the metal shielding box 33 has the function of the heat sink 5 in the first embodiment. The thermally conductive sheet 7 is installed between the heating element 1 and the inner wall of the metal shielding box, and between the metal shielding box 33 and the housing 4 is an air layer 6.

[0069] By doing so, the same effect as in Example 1 can be obtained, and since the mounting of the heat sink can be omitted, the effect of reducing the assembly cost can be obtained.

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Abstract

According to the prior art, it is difficult to efficienly cool hot components mounted on a printed-circuit board as well as the surface of the case of a communication device. To solve this problem, a communication device of this invention comprises a communication circuit including hot components mounted on a printed-circuit board; a shield case covering the communication circuit to isolate it from external electromagnetic radiation; a case enclosing the shield case and the printed-circuit board; a material spread along the inner wall of the shield case to diffuse heat in both directions; and a heat-insulating layer provided between the shield case and the inner wall of the case.

Description

technical field [0001] The present invention relates to a communication device, and specifically relates to a heat dissipation structure for dissipating heat generated by an exothermic element arranged in a housing. Background technique [0002] Conventional electronic devices such as portable communication devices have a heat dissipation function for dissipating heat generated by built-in heat generating elements, as shown in FIG. 17, for example. FIG. 17 is a cross-sectional view showing the main structure of a conventional portable communication device shown in Japanese Patent Publication No. 11-204970 published in 2011. In this figure, 1 is a heat generating element (hereinafter referred to as a heat generating element), 2 is a printed circuit board on which a communication circuit having a heat generating element 1 is mounted, 4 is a case for storing the above printed circuit board 2, and 10 is a heat sink. . [0003] The thermal conductivity of air is very small at 0...

Claims

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Application Information

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IPC IPC(8): H05K7/20H05K9/00
CPCH05K7/20445H05K9/0024H05K9/0026
Inventor 下地美保子尾崎永一中尾一成大串哲朗平尾康一长谷川学小林孝吉沢二郎
Owner MITSUBISHI ELECTRIC CORP
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