Cutting tip monitoring device for cutting device

Abstract

Provided is a cutting blade monitoring device for a cutting device capable of correctly detecting the state of a cutting edge of a cutting blade without being affected by cutting water or contamination, which can also be applied to cutting devices having multiple blades. This cutting blade monitoring device is for a cutting device provided with a workpiece holding means to hold a workpiece, and a cutting means to cut the workpiece held by the workpiece holding means, where the cutting means is provided with a rotary spindle, and a cutting blade installed on the rotary spindle, and provided with a cutting edge comprising abrasive grains fixed by magnetic material. It is provided with a magnetism sensor disposed to face the outer circumference of the cutting edge of the cutting blade, and a control means to determine the state of the cutting edge based on detection signals from the magnetism sensor.

Description

technical field [0001] The present invention relates to a cutting blade monitoring device of a cutting device, and more specifically, to a cutting blade monitoring device of a cutting device for determining the breakage and wear limit of a cutting blade for cutting workpieces such as semiconductor wafers. Background technique [0002] As is well known to those skilled in the art, in a semiconductor device manufacturing process, the surface of a generally wafer-shaped semiconductor wafer is divided into a plurality of regions by lines (cutting lines) arranged in a grid. Circuits such as ICs and LSIs are formed in this divided area. Then, by cutting the semiconductor wafer along the lanes, the regions where the circuits are formed are separated, and individual semiconductor chips are manufactured. Typically, semiconductor wafers are severed along the lanes using a cutting device known as a slicer. This cutting device includes: a chuck table as a workpiece holding unit that h...

AI Technical Summary

Problems solved by technology

[0005] (1) Due to the influence of cutting water, light is refracted, and although there is no damage to the cutting edge, it may be misjudged that damage has occurred

[0006] (2) If dirt generated by cutting adheres to the light-emitting surface of the light-emitting element or the light-receiving surface of the light-receiving element, the amount of light received by the light-receiving element will change, so the state of the cutting edge of the cutting blade cannot be accurately detected

[0007] (3) Since the light-emitting element and the light-receiving element are arranged so as to sandwich the cutting edge of the cutting insert, it is difficult to apply to the so-called multi-blade case in which two or more cutting inserts are arranged in the axial direction.

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