Optical head device

Abstract

The invention provides an optical head device. The laser element mounting part (7) on a frame is a cylindrical part (71) mountable of a cylindrical case of a first type semiconductor laser element. In addition, a pair of grooves 72, 73 mountable of overhanging parts to both sides of a radiating plate (61) of a second type semiconductor laser element are formed at a surrounding wall (710) of the cylindrical part (71). A guiding part (77) with an opening wider and thicker than the radiating plate (61) is formed at the inlet side of the grooves (72) / (73)(the outside of the inserting direction), and wherein locating parts (78), (79) for pressing the radiating plate (61) to the side wall (720), (723) are formed. The invention provides an optical head device in which any type of semiconductor laser elements different in a size and a shape can be used.

Description

[0001] This application is a divisional application of the invention patent application with the application number 02157476.6 and entitled "Optical head device". technical field [0002] The present invention relates to an optical head device used for recording and playing optical recording media such as CD, CD-R, and DVD. Background technique [0003] In the optical head device used for recording and playing optical recording media such as CD, CD-R, DVD, etc., the emitted light from the semiconductor laser element as the light source is guided to the objective lens through the light guide system, and the light condensed by the objective lens is condensed. beam onto a disc-shaped optical recording medium. At this time, the driving of the objective lens in the tracking direction and the focusing direction is performed by the lens driving device. Return light from the optical recording medium is also guided to the light receiving element by the light guide system. [0004] ...

AI Technical Summary

Problems solved by technology

[0007] The laser element mounting part is changed according to the shape of the laser element so that the second type of semiconductor laser element can be mounted on the frame, but in terms of reliability or characteristics, when using the first type of semiconductor laser element, there is no way to use the first type of semiconductor laser element. 1 Problem of Mounting a Semiconductor Laser Element on a Frame

[0008] And if form the straight hole that conforms to the size of heat dissipation plate 61 as the laser element mounting part that mounts the second kind of semiconductor laser element 60 usefulness, then when heat dissipation plate 61 is inserted into groove portion, heat dissipation plate 61 is hung on the inside of the groove. The side wall is installed obliquely, resulting in the problem that the optical axis of the second semiconductor laser element 60 is shifted and tilted.

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