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Making method for seed layer combined to seed fixing film and structure thereof

A technology for fixing film and seeds, applied in the field of seed layer manufacturing method and its structure, to achieve the effects of increasing output value, simplifying planting procedures, and reducing production costs

Inactive Publication Date: 2007-05-02
柯文灿
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] It can be seen that there are still many defects in the above-mentioned commonly used methods, which are not really a good way, and urgently need to be improved.

Method used

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  • Making method for seed layer combined to seed fixing film and structure thereof
  • Making method for seed layer combined to seed fixing film and structure thereof
  • Making method for seed layer combined to seed fixing film and structure thereof

Examples

Experimental program
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Embodiment 1

[0022] As shown in Fig. 1, Fig. 2 and Fig. 3, the structure of the seed layer provided by the present invention combined on the seed fixing film mainly includes:

[0023] A seed 1 (as shown in FIG. 1A ), which can be the seeds of various edible vegetables, and can be selected and used according to requirements;

[0024] A first layer of colloid 2 (as shown in Figure 1B), the first layer of colloid 2 is coated on the surface of the seed 1;

[0025] An additive 3 (as shown in Figure 1C), the additive 3 is coated on the surface of the first layer of colloid 2; the additive 3 can be a seed preservative, a nutrient, a fertilizer, an anti-disease and insect pest agent and / or various additives such as microbial strains, and add the required additives according to the growth needs of various vegetable plants and different functions;

[0026] A second layer of colloid 4 (as shown in Figure 1D), the second layer of colloid 4 is coated on the surface of the additive 3;

[0027] A seed...

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PUM

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Abstract

Disclosed is a making method for seed layer combined to seed fixing film and structure, wherein the process comprises coating a layer of colloid the surface of the seeds, then coating a layer of additive onto the colloid, coating a layer of colloid onto the additive, so as to obtain a layered structure of the seeds exterior layer, finally placing one or multiple seeds onto a fixation film at equal intervals, and melting the exterior colloid through heating.

Description

technical field [0001] The present invention relates to a method for making a seed layer combined with a seed-fixed film and its structure, in particular to a method in which plant or vegetable seeds are formed in a multi-layered form, and the seeds are placed on the seed-fixed film On the above, after heating, the seeds can be fixed on the seed fixed film, which is a method of making the seed layer combined with the seed fixed film and its structure. Background technique [0002] Common plant or vegetable planting methods are mostly operated in accordance with the process of loosening the soil, sowing, fertilizing, killing insects, and harvesting. There are also regular tedious tasks such as watering and weeding in order to produce various plants for people to watch , Vegetables for human consumption. [0003] When general farmers plant plants or vegetables, they must plant seeds manually or with machines; however, if they are planted manually, they will need to spend a lo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A01C1/06
Inventor 柯文灿
Owner 柯文灿