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Application of film using PVDF, PMMA or their mixture as base in covering thermosetting material article

A thermosetting, thin-film technology, used in film/sheet adhesives, pressure-sensitive films/sheets, grafted polymer adhesives, etc., to solve problems such as the lack of adhesion of PVDF layers

Inactive Publication Date: 2007-05-16
ATOFINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The PVDF layer of these structures does not have sufficient adhesion

Method used

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  • Application of film using PVDF, PMMA or their mixture as base in covering thermosetting material article
  • Application of film using PVDF, PMMA or their mixture as base in covering thermosetting material article
  • Application of film using PVDF, PMMA or their mixture as base in covering thermosetting material article

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0151] Composition of the adhesive layer: it contains 50% Kynar 720, 15% OROGLAS V 825 T and 35% EXL 3600 by weight.

[0152] Composition of PVDF layer: 80% by weight Kynar 720 - 20% by weight OROGLAS V 825 T.

[0153] Resin composition: phthalic acid-based polyester SMC typical resin.

[0154] At the bottom of the flat die head heated at 140°C, put a double-layer film made of the adhesive layer of the present invention and the PVDF layer (A) obtained by conventional film co-extrusion technology. A commercially available SMC resin sample provided by CRAY VALLEY was cut to cover approximately 70% of the mold interior. The structure was then molded for 5 minutes and cooled for 2 minutes. After demoulding, it is absolutely impossible to peel off the cross-linked resin bilayer.

[0155] A felt indelible Staedtler(R) Lumocolor Pennanent marking painted on the surface covered with the film according to the invention is easily wiped off, whereas on the uncovered surface it is impo...

Embodiment 2

[0157] Embodiment 2 (comparison)

[0158] At the bottom of the flat die head heated at 140°C, put a double-layer film obtained by conventional film coextrusion technology in advance, which consists of the same adhesive layer as in Example 1, but the PMMA is not functionalized (i.e. OROGLAS V 825 T) and a PVDF layer (A) (the same as that of Example 1). A commercially available SMC resin sample (same as in Example 1) provided by CRAYVALLEY was cut to cover about 70% of the mold interior. The structure was then molded for 5 minutes and cooled for 2 minutes. After demolding, the fluorine-containing double layer of the cross-linked resin may be peeled off.

Embodiment 3

[0159] Embodiment 3 (comparison)

[0160] At the bottom of the flat die head heated at 140°C, a PVDF single-layer film obtained by the usual film co-extrusion technology is placed in advance. A commercially available SMC resin sample (same as in Example 1) provided by CRAY VALLEY Company was cut to cover about 70% of the mold interior. The structure was then molded for 5 minutes and cooled for 2 minutes. After demoulding, it is possible to peel off the PVDF monolayer film of the cross-linked resin.

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Abstract

The present invention relates to the use of films, formed from an adhesive layer and a layer (A), for coating articles made of a thermoset, the adhesive layer comprising, by weight: 0 to 60 parts of PVDF, 10 to 100 parts of functionalized PMMA, 0 to 50 parts of an acrylic elastomer and 0 to 4 parts of a UV absorber, the total making up 100 parts, the layer (A) comprising, as main constituents, 0 to 100 parts of PVDF per 100 to 0 parts of PMMA, respectively. This film may be manufactured by coextrusion and is then fixed to the thermoset, for example by hot pressing. The film may also be deposited in a mould, the layer (A) being placed against the wall of the mould, then to inject the precursor of the thermoset into the mould (i.e. on the adhesive layer side) and then to cause crosslinking in order to obtain a thermoset coated with the layer (A). The invention also relates to an SMC (Sheet Moulding Compound) multilayer structure comprising, in this order: a backing film, a crosslinkable composition (the precursor of the thermoset), the above adhesive layer and the above layer (A). The SMC structure is cut as required, the backing film is peeled off, the structure is placed in a mould and then the crosslinking is carried out in order to obtain an article made of a thermoset covered with a film of the layer (A).

Description

【Technical field】 [0001] PVDF (polyvinylidene fluoride) is used to protect objects or materials due to its very good resistance to weathering, radiation and chemical products. In addition, it is known for its shiny appearance and its scratch resistance. Therefore, people are attracted to cover any type of substrate with PVDF film, especially thermoset materials. However, PVDF adheres poorly to thermosets, so it is necessary to place an adhesive composition between PVDF and thermosets. This composition is coextruded with PVDF to form a bilayer film which is then fixed to a thermoset, for example by means of heat pressing. It is also possible to place the bilayer film in a mold with the PVDF layer facing the mold wall, then inject the thermoset precursor into the mold and initiate crosslinking to obtain a PVDF-covered thermoset. PVDF can also be a mixture of PVDF and PMMA. For applications under less aggressive conditions, only PMMA can be used. 【technical background】 [...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B7/12B32B37/00C09J127/12B32B27/30B32B27/08C08J5/12C09J7/22C09J7/38C09J11/06C09J127/16C09J133/00C09J133/08C09J133/12C09J151/00C09J151/06
CPCC09J7/0246C09J2427/00C09J2427/006C08J5/128C09J2433/006C09J7/0217C09J2433/00B32B27/08C09J7/38C09J7/385C09J7/22C09J133/08B32B2398/10B32B27/304B32B2250/24B32B7/12B32B27/34
Inventor A·博内P·布西D·西拉吉
Owner ATOFINA