Application of film using PVDF, PMMA or their mixture as base in covering thermosetting material article
A thermosetting, thin-film technology, used in film/sheet adhesives, pressure-sensitive films/sheets, grafted polymer adhesives, etc., to solve problems such as the lack of adhesion of PVDF layers
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Embodiment 1
[0151] Composition of the adhesive layer: it contains 50% Kynar 720, 15% OROGLAS V 825 T and 35% EXL 3600 by weight.
[0152] Composition of PVDF layer: 80% by weight Kynar 720 - 20% by weight OROGLAS V 825 T.
[0153] Resin composition: phthalic acid-based polyester SMC typical resin.
[0154] At the bottom of the flat die head heated at 140°C, put a double-layer film made of the adhesive layer of the present invention and the PVDF layer (A) obtained by conventional film co-extrusion technology. A commercially available SMC resin sample provided by CRAY VALLEY was cut to cover approximately 70% of the mold interior. The structure was then molded for 5 minutes and cooled for 2 minutes. After demoulding, it is absolutely impossible to peel off the cross-linked resin bilayer.
[0155] A felt indelible Staedtler(R) Lumocolor Pennanent marking painted on the surface covered with the film according to the invention is easily wiped off, whereas on the uncovered surface it is impo...
Embodiment 2
[0157] Embodiment 2 (comparison)
[0158] At the bottom of the flat die head heated at 140°C, put a double-layer film obtained by conventional film coextrusion technology in advance, which consists of the same adhesive layer as in Example 1, but the PMMA is not functionalized (i.e. OROGLAS V 825 T) and a PVDF layer (A) (the same as that of Example 1). A commercially available SMC resin sample (same as in Example 1) provided by CRAYVALLEY was cut to cover about 70% of the mold interior. The structure was then molded for 5 minutes and cooled for 2 minutes. After demolding, the fluorine-containing double layer of the cross-linked resin may be peeled off.
Embodiment 3
[0159] Embodiment 3 (comparison)
[0160] At the bottom of the flat die head heated at 140°C, a PVDF single-layer film obtained by the usual film co-extrusion technology is placed in advance. A commercially available SMC resin sample (same as in Example 1) provided by CRAY VALLEY Company was cut to cover about 70% of the mold interior. The structure was then molded for 5 minutes and cooled for 2 minutes. After demoulding, it is possible to peel off the PVDF monolayer film of the cross-linked resin.
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Abstract
Description
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Application Information
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