Leadframe for semiconductor device, method for manufacturing semiconductor device using the same and electronic equipment

Abstract

A leadframe to be used in a semiconductor device comprises a plurality of parallel first leads and a plurality of parallel second leads. The pitch of the first leads is different from that of the second leads, and the first leads are joined end-to-end with the second leads. To obtain a leadframe for DIP packages, the first leads are encapsulated in a package and the second leads are allowed to project from the package. To obtain a leadframe for SOP packages, the first leads and the second leads are allowed to project from a package and the second leads are cut off later.

Description

technical field [0001] The present invention relates to a leadframe for a semiconductor device, a method of manufacturing a semiconductor device using the leadframe, a semiconductor device using the leadframe, and electronic equipment. Background technique [0002] Lead sockets for semiconductor devices (for example, optocoupler devices) include many variations, such as for DIP (Dual Inline Package, dual inline package) package and SOP (Small Outline Package, small outline package) (see sequence Published Japanese Patent No. H7-94657). A leadframe for a DIP package has leads inserted into holes in a substrate, the leads have a terminal thickness of 0.25mm and a pitch spacing of 2.54mm. Leadframes for SOP packages have leads placed on the surface of the substrate with a tip thickness of 0.15 to 0.20 mm and a pitch spacing of 1.27 mm. [0003] FIG. 4A is a plan view of a photocoupling device using a conventional lead frame for a DIP package, and FIG. 4B shows the internal st...

AI Technical Summary

Problems solved by technology

Under such circumstances, arranging the production schedule of individual semiconductor devices has become a difficult task

It is often the case that manufacturers may be overwhelmed with orders that exceed their capacity, or cannot meet unexpected orders

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