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Electronic device contg. multi-layer printed circuit board

A technology for printed circuit boards and electronic equipment, which is applied in the direction of printed circuits, structural connections of printed circuits, printed circuit components, etc., and can solve assembly sequence restrictions, connector 4 and electronic component 3 installation position restrictions, printed circuit board assembly Problems such as larger space occupation

Inactive Publication Date: 2002-12-04
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, there is a problem that the space occupied by the printed circuit board assembly becomes larger and the size of the electronic device becomes larger
[0006] In addition, in order to facilitate the connection operation of the connector 4, it is necessary to arrange the connector 4 near the edge of the printed circuit board 1a, and there is a difficulty that the mounting position of the connector 4 and the electronic component 3 is limited.
[0007] Moreover, since the wire 5 needs to continue along the upper surface of the printed circuit board 1a with the electronic components 3 mounted thereon, the assembly wiring diagram of other electronic components arranged on the path of the wire 5 is unfavorably limited.
[0008] In addition, in the manufacturing process of the printed circuit board assembly, after the wire 5 is connected to the connector 4 of the printed circuit board 1a, another printed circuit board 1b needs to be attached, and another difficulty is that the assembly sequence is also limited.

Method used

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  • Electronic device contg. multi-layer printed circuit board
  • Electronic device contg. multi-layer printed circuit board
  • Electronic device contg. multi-layer printed circuit board

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Embodiment Construction

[0017] Specific embodiments of the present invention will be described below with reference to the accompanying drawings.

[0018] figure 1 is a cross-sectional view of the printed circuit board assembly 10 according to the first embodiment of the present invention.

[0019] The printed circuit board assembly 10 is assembled from two printed circuit boards 11 a , 11 b vertically stacked on top of each other via a constant gap 12 . On the upper surfaces of the printed circuit boards 11a, 11b, electronic circuits are printed / wired and a large number of electronic components 13 are mounted. The electronic component 13 may include a Bluetooth module 13a or a wireless LAN module 13a.

[0020] In addition to the electronic components 13, a connector 14 is arranged on the upper surface of the lower printed circuit board 11a arranged opposite to the upper printed circuit board 11b. Connected to the connector 14 are wires 16 for electrically connecting the connector with external e...

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PUM

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Abstract

The invention relates to an electronic device containing a plurality of printed circuit board layers, wherein a printed circuit board arrangement (10) is assembled from two stacked printed circuit boards (11a, 11b) separated by a gap (12). The connector (14) is arranged on the lower printed circuit board (11a). A through hole (15) is formed in the upper printed circuit board opposite the connector (14). The wire (16) passes through the through hole (15) and is connected to the connector (14).

Description

technical field [0001] The present invention relates to a printed circuit board assembly mounted in, for example, an electronic equipment housing, and an electronic equipment comprising a plurality of printed circuit boards stacked on top of each other and assembled in the housing. Background technique [0002] It is known that small-sized electronic devices are superior in portability, such as notebook-sized personal computers (notebook-sized PCs). In the housing of electronic equipment, batteries and electronic circuits are assembled, and printed circuit boards with a large number of electronic components are assembled in high density. [0003] Usually, two or three printed circuit boards are stacked on each other to form a printed circuit board assembly, and the space occupied by the printed circuit boards should be set as small as possible to miniaturize the electronic equipment. [0004] However, if Figure 4 As shown, in a conventional printed circuit board assembly f...

Claims

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Application Information

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IPC IPC(8): H05K1/02H01R13/56H05K1/14H05K7/14
CPCH01R13/56H05K1/144H01R12/52
Inventor 松下聪
Owner KK TOSHIBA