Pattern evaluating apparatus, pattern evaluating method and program

Abstract

A pattern evaluation system which receives image data of a pattern to be evaluated to evaluate the pattern includes an edge model producing part which produces a pattern edge model and an edge point coordinate detecting part which carries out an image matching processing to an image of the pattern with the pattern edge model to detect coordinates of an edge point of the pattern.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of priority of Japanese Patent Application No. 2001-294209 filed on September 26, 2001 based on 35 USC $119; the contents of which are incorporated herein by reference. technical field [0003] The present invention relates to a pattern evaluation device, evaluation method and program for pattern size and shape measurement. Background technique [0004] A conventional pattern evaluation method will be described by taking a specific example of an evaluation method for a fine pattern of a semiconductor. [0005] The evaluation of patterns is very important in the manufacturing process of semiconductors, especially for fine patterns formed by photolithography and etching processes. Conventionally, the evaluation method of CDSEM (Critical Dimension Scanning Electron Microscope) using electron beams is generally used to evaluate the size of patterns (for example, the line width of linear...

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Problems solved by technology

[0008] However, in the above-mentioned existing methods for detecting contour points of figures, due to the shape or position of figures, the contours cannot be detected or the contours are detected incorrectly.

Moreover, in the above-mentioned existing method, the size of the ROI obtained by decomposing the graphic will also change the detection result of the graphic size

At the same time, in the above-mentioned existing methods, the ROI must be specified, which makes the designation of the ROI require complicated steps when the shape of the measured figure is complex, and the workload of the measurer increases, which even leads to the reliability of automatic detection. reduce

Moreover, in the above existing methods, the contrast / black and white of the measured pattern, or the change of the taper angle on the side of the pattern wall, etc. may cause the change of the result of pattern size detection.

Furthermore, in the above-mentioned conventional method, there is also the problem that the detection result such as the pattern size depends on the detection magnification.

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