Electronic device packaging
A device, plastic packaging technology, applied in the field of sealing packaging of electronic devices, multi-layer sealing coating, and manufacturing sealing coating devices, which can solve the problems of destroying wire bonds, protecting wires and wire bonding without help, edge exposure, etc.
Inactive Publication Date: 2003-05-07
MAXWELL ELECTRONICS COMPONENTS GROUP
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Problems solved by technology
Defects associated with this susceptibility include: moisture-induced corrosion, chemical damage to wire bonds, internal circuitry and other relevant aspects of the device
The problem is that once the IC die is cut from the wafer, the edges of the IC die are exposed and susceptible to impurities
Moreover, the pads on the surface of the semiconductor integrated circuit die must be exposed (for example for wire bonding), thus further creating areas susceptible to impurities
So the downside is that this way it doesn't help to protect the wires and wire bonds, impurities in one node can cause failure
Method used
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[0033] The present best mode for carrying out the invention described below is not meant to be limiting, and its purpose is only to illustrate the principles of the invention. The scope of the invention should be determined with reference to the claims.
[0034] see first Figure 1A , which represents a cross-section of a plastic package structure (or plastic-encapsulated microelectronics (PEM) device), which includes a plastic package, a die-attached substrate, a semiconductor integrated circuit, leads, wire bonds, and wires. In fact, those skilled in the art are well aware that the wires already form part of the lead frame before the assembly of the plastic package structure. The lead frame holds and lines up the wires until the wires are wrapped by plastic encapsulation at each internal end point of the wires.
[0035]Prior to encapsulation, the die and die-attached substrate are positioned near the center of the leadframe, near the inner terminations of the leads, and the ...
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A hermetically coated device includes an integrated semiconductor circuit die, a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die, a second layer, the second layer enveloping the integrated semiconductor circuit die. Formation of such device includes steps of providing an integrated semiconductor circuit die, applying a first layer comprising an inorganic material, the first layer enveloping the integrated semiconductor circuit die, and applying a second layer, the second layer enveloping the integrated semiconductor circuit die.
Description
Background of the invention [0001] The present invention relates to packaging of electronic devices, in particular to hermetic packaging of electronic devices. More particularly, the invention relates to multilayer hermetic coatings in electronic device packaging. [0002] Semiconductor integrated circuits are key devices in most electronic systems today. These semiconductor integrated circuits have been widely used in various fields. Historically, manufacturers have designed two forms of semiconductor integrated circuits. One is a device packaged in a non-hermetic plastic package (plastic encapsulated microelectronics (PEM) device), such as molded epoxy, silicone, or phenolic, and the other is a hermetically sealed ceramic package. Hermetic ceramic packages are often used in very sensitive, harsh environments and / or applications requiring high reliability, such as military applications, including weapons systems; space applications, such as those used on earth-orbiting sat...
Claims
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IPC IPC(8): H01L21/56H01L23/29H01L23/31H01L23/49
CPCH01L2924/01015H01L2224/85205H01L2924/01055H01L2924/01082H01L2924/00014H01L2924/01041H01L2924/01018H01L2224/32245H01L2924/01038H01L2924/01029H01L2224/48453H01L2924/01022H01L2924/01083H01L2224/48091H01L2924/014H01L2924/01013H01L2924/01056H01L2924/01072H01L24/48H01L2224/8592H01L24/45H01L23/3135H01L2224/4845H01L2924/3011H01L2224/85399H01L2224/4807H01L2924/01007H01L2224/48465H01L2924/0104H01L2224/48247H01L2224/45099H01L2224/48227H01L2924/14H01L2924/01033H01L2924/01006H01L2924/01078H01L2224/05599H01L2924/01057H01L2924/01014H01L2924/01073H01L2924/01058H01L2924/01012H01L2224/73265H01L23/293H01L2924/181H01L2924/12042H01L24/73H01L2924/00H01L2924/00012H01L23/29
Inventor M·费瑟白J·L·德哈文
Owner MAXWELL ELECTRONICS COMPONENTS GROUP