Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor buffer capacity regulating method, electronic system and semiconductor device

A technology of buffer capacity and adjustment method, applied in semiconductor devices, semiconductor/solid-state device manufacturing, electric solid-state devices, etc., can solve the problems of deterioration of signal waveform quality, change of buffer capacity of semiconductor devices, and component damage.

Inactive Publication Date: 2003-07-02
KK TOSHIBA
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, there is a difference in impedance on the printed substrate that transmits semiconductor signals
[0008] When this difference in characteristics exceeds the limit, the buffer capability of the semiconductor device fluctuates and the quality of the signal waveform deteriorates
This leads to misoperation of semiconductor devices or element destruction

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor buffer capacity regulating method, electronic system and semiconductor device
  • Semiconductor buffer capacity regulating method, electronic system and semiconductor device
  • Semiconductor buffer capacity regulating method, electronic system and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] Embodiments of the present invention will be described below with reference to the drawings.

[0028] figure 1 It is a configuration diagram showing a semiconductor buffer capacity adjustment system according to an embodiment of the present invention. exist figure 1 In such a system, multiple semiconductor memories mounted on a memory module are subject to adjustment of the buffer capacity. The system is realized in the form of electronic equipment such as a personal computer or a portable information terminal.

[0029] This system has a memory module 2 in which a plurality of semiconductor memories (DRAM, etc.) 1a-1d are mounted, a BIOS (Basic Input / Output System) 3 that mainly performs setting processing related to a hardware configuration, and a memory module 2 that controls the memory module 2 through a memory bus. Data input and output to the memory controller 4 .

[0030] Each semiconductor memory on the memory module 2 has electrical characteristics differenc...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention is to configure ROM (5) in the memory module (2) for memorizing the characteristic distribution information with values representing the characteristic distribution for each semiconductor memory (1a to 1d). The characteristic distribution information is the data measured in the stage of manufacturing semiconductor device, for example. The BIOS (3) can read the characteristic distribution information memorized in ROM (5) during initialization, and obtain the optimized value of buffer capacity for each semiconductor memory based on the characteristic distribution information, and conduct the configuration process for suitably adjusting the buffer capacity for each semiconductor memory by the memory controller (4) through the local bus. The memory controller (4) can suitably adjust the signal for the signal intensity of buffer capacity for each semiconductor memory according to the contents configured by the BIOS (3), so as to supply it to the memory module (2).

Description

technical field [0001] The invention relates to a semiconductor buffer capacity adjustment method for adjusting the semiconductor buffer capacity, an electronic system and a semiconductor device. Background technique [0002] In recent years, various semiconductor devices have been developed and manufactured according to their applications. Among the semiconductor devices, there are various types of semiconductor devices in which a single semiconductor memory is used connected to a memory controller and the semiconductor memory is mounted on a plurality of substrates and modularized. [0003] In order to ensure stable signal quality over a certain amount, semiconductor devices must be designed and manufactured to have moderate buffering capabilities. [0004] For example, when a large load is applied, the parasitic input capacitance increases, and the buffer capacity must be increased because the rising edge of the semiconductor input signal waveform is gentle. On the othe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G11C17/00G06F13/42G11C11/417G11C16/02H03K19/0175
CPCG11C7/1066G11C7/1057G11C7/04G11C7/1084G06F13/4239
Inventor 蜂谷尚悟
Owner KK TOSHIBA