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Semiconductor device

A technology for semiconductors and devices, applied in the field of resin-sealed semiconductor devices, can solve the problems of large differences in resin filling and other problems

Inactive Publication Date: 2003-09-10
NEC ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problem of a large difference in resin filling between the top surface of the semiconductor chip and the inner lead edge-island cannot be resolved

Method used

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  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

Examples

Experimental program
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Embodiment Construction

[0026] The present invention will be described below with reference to the accompanying drawings. 1 is a view describing a semiconductor device of an embodiment of the present invention, in a state where a semiconductor chip is mounted on a lead frame, and electrodes of the semiconductor chip and edge portions of internal leads are connected by bonding wires, wherein Figure 1A is the floor plan, Figure 1B yes Figure 1A The enlarged floor plan of the part 110 indicated by the dotted line in . The other three hanger leads and their peripheral parts have the same structure.

[0027] 2 is a view describing an inner lead of a lead frame and a peripheral portion thereof of an embodiment of the present invention, wherein, Figure 2A is the floor plan, Figure 2B yes Figure 2A An enlarged plan view of the portion 120 indicated by the middle dotted line. The other three hanger leads and their peripheral parts have the same structure.

[0028] In the figure, four hanger leads...

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PUM

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Abstract

A semiconductor device of the present invention has an island; a semiconductor pellet fixed onto the island; many inner leads extended to the island; a resin sealing the island, semiconductor pellet and inner leads; and resin flow control plates provided between the edges of the inner leads and the island.

Description

technical field [0001] The present invention relates to a semiconductor device. More specifically, the present invention relates to a resin-sealed type semiconductor device having more pins and a smaller semiconductor chip. Background technique [0002] Due to the need for more PKG pins and a smaller semiconductor chip, there is a larger space between the edges and the islands of the leads inside the semiconductor device. [0003] Fig. 7 is a schematic diagram describing a prior art semiconductor device, wherein a semiconductor chip is fixed on a lead frame, and electrodes of the semiconductor chip are connected to inner lead edge portions by bonding wires, wherein, Figure 7A is a planar graph, Figure 7B is an enlarged plan view, which is enlarged in Figure 7A The portion 210 marked with a dotted line. The other three hanger leads and their peripheral parts have the same structure. [0004] In FIG. 7 , an island 1 on which a semiconductor chip 2 is fixed and mounted is...

Claims

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Application Information

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IPC IPC(8): H01L23/28H01L21/56H01L23/495H01L23/50
CPCH01L23/49541H01L23/49503H01L2224/45144H01L2924/01079H01L24/48H01L2224/48091H01L2224/49171H01L24/49H01L2224/48247H01L21/565H01L24/45H01L2224/45015H01L2924/00014H01L2924/181H01L2924/00H01L2924/20752H01L2224/05599H01L2924/00012H01L23/28
Inventor 伊藤隆博
Owner NEC ELECTRONICS CORP