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Structure for interconnecting conductors and connecting method

A technology of connection structure and connection method, applied in welding/welding connection, reinforcement of conductive pattern, welding medium, etc., can solve problems such as poor operability and poor operability

Inactive Publication Date: 2003-09-10
ROHM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if gold plating is not performed on the mounting terminal pads, the mounting terminal pads must be covered with a mask, and the mask must be removed after the plating is completed, resulting in poor operability and a disadvantage in terms of cost.
In particular, when gold plating is performed by electrolytic plating, it is necessary to form a mask on the mounting terminal pad, and the workability is further deteriorated.

Method used

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  • Structure for interconnecting conductors and connecting method
  • Structure for interconnecting conductors and connecting method
  • Structure for interconnecting conductors and connecting method

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Embodiment Construction

[0028] Other features and advantages of the present invention will be apparent from the following detailed description with reference to the accompanying drawings.

[0029] Refer to the following figure 1 Preferred embodiments of the present invention will be described in detail. here, figure 1 A cross-sectional view showing a connection structure between conductors according to an embodiment of the present invention.

[0030] exist figure 1 Among them, the circuit board 1 has, for example, a protection circuit for preventing overcharging of the rechargeable battery. The circuit board 1 has a wiring pattern (not shown) made of Cu on a substrate 10 made of, for example, glass epoxy resin. The Cu wiring pattern is formed by forming a Cu film with a thickness of about 15 to 25 μm on one side of the substrate 10 by, for example, CVD or vapor deposition, and then etching unnecessary portions.

[0031] A plurality of terminal pads 11a, 11b, 11c are formed at appropriate positio...

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Abstract

A first conductor having a surface formed with an Au layer is connected, via a Zn-containing solder, to a second conductor which is conductive at least at a surface thereof. The first conductor may be, for example, a terminal pad (11a, 11b, 11c) constituting a part of a wiring pattern on a circuit board (1), whereas the second conductor may be a terminal (20a, 21a) of an electronic component (20, 21) or a terminal plate (22). The first conductor is connected to the second conductor via an Au-Zn alloy layer which is formed as a result of the diffusion of Zn from the Zn-containing solder into the Au layer of the first conductor.

Description

technical field [0001] The invention relates to a technique for connecting a conductor with an Au layer on its surface and other conductors through soldering. Background technique [0002] In the prior art, for example, when electronic components such as semiconductor chips are mounted on a circuit board, a method of electrically and mechanically connecting terminal pads provided on the circuit board and terminals of the electronic component by soldering is used. The terminal pads on the circuit board are formed, for example, by forming a Cu wiring pattern on the circuit board, and then forming a Ni-plated layer and an Au-plated layer on the portion to be the terminal pad. Here, the purpose of forming the Au plating layer as the uppermost layer is to prevent oxidation of the surface of the terminal pad and to secure connection reliability with the terminals of the electronic component. In addition, Ni plating is performed because it is difficult to perform Au plating direct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/00B23K35/26B23K35/28B23K35/30H05K3/24H05K3/34
CPCY10T428/2495B23K35/007Y10T428/12903B23K35/262B23K35/282Y10T428/12889H05K3/244Y10T428/12708Y10T428/265Y10T428/12882B23K35/3013Y10T428/12792H05K3/3463H05K3/34
Inventor 中村聪
Owner ROHM CO LTD