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Method for conecting integrated circuit with substrate and corresponding circuit confiuration

A technology of integrated circuit and circuit configuration, which is applied in the direction of circuits, electrical components, electric solid devices, etc., and can solve the problem that the contact units are not fixedly connected to each other

Inactive Publication Date: 2004-03-10
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] At present, there is no structure or method in which the contact units are not fixedly connected to each other

Method used

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  • Method for conecting integrated circuit with substrate and corresponding circuit confiuration
  • Method for conecting integrated circuit with substrate and corresponding circuit confiuration
  • Method for conecting integrated circuit with substrate and corresponding circuit confiuration

Examples

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Embodiment Construction

[0031] In the figures, components that are the same or have the same function are denoted by the same reference numerals.

[0032] figure 1 A schematic diagram showing part of a circuit configuration according to an embodiment of the present invention.

[0033] figure 1 In, reference numeral 1 denotes an integrated circuit integrated in a semiconductor chip (for example, a silicon chip), which has a first front main region HF1 and a second rear main region HF2.

[0034] Although only one semiconductor chip is shown in this example, it should be expressly pointed out that the method according to the invention and the corresponding circuit arrangement can be implemented at a higher level, eg wafer level.

[0035] also, figure 1 The reference number 2 in the figure indicates the electrical contact of the integrated circuit 1 on the first main area HF1 for wiring metallization or metallization 4 . The first main area HF1 is not depicted in detail. The contacts 2 are guided th...

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PUM

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Abstract

A process for connecting an integrated circuit (1), especially a chip, wafer or hybrid, with a substrate (30) provides corresponding electrical contacts on the IC (3,4) and substrate (33), at least one of which is elastically elevated and bringing the IC to a frame (22) and joining the electrical contacts together by compressing the elastic elevation. An Independent claim is also included for the device formed as above.

Description

technical field [0001] The invention relates to a method of connecting an integrated circuit to a substrate and a corresponding circuit arrangement. [0002] Although in principle the invention is applicable to any desired integrated circuit, the description and its problems will only be described with respect to chips with integrated circuits in semiconductor technology. Background technique [0003] The known methods of CSP (Chip Scale Packaging) or WLP (Wafer Level Packaging) of connecting an integrated circuit to a substrate, both have reliability problems when subjected to temperature variations, especially for large chips. [0004] Regarding chip-level packaging and wafer-level packaging, there are actually only two connection structures between the chip and the substrate so far. [0005] A customary method of attaching an integrated circuit to a substrate is to use a ball grid arrangement of rigid solder balls or bumped pads for mechanical connection, in addition to ...

Claims

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Application Information

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IPC IPC(8): H01L21/60H01L23/04H01L23/485
CPCH01L23/04H01L24/10H01L2924/16195H01L2924/01082H01L24/81H01L2924/01079H01L2924/01068H01L2224/81801H01L2224/16H01L2924/14H01L2924/01076H01L2224/73253H01L2924/01005H01L2924/01033H01L2924/01006H01L2924/01029H01L2224/13099H01L2924/10253H01L2924/014H01L24/13H01L2224/10135H01L2224/13H01L2224/81136H01L2224/81139H01L2924/00
Inventor 哈里·黑德勒
Owner INFINEON TECH AG
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