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Radiator and its producing method

A manufacturing method and radiator technology, which are applied to instruments, electric solid state devices, semiconductor devices, etc., can solve the problem of high processing difficulty, and achieve the effects of saving manufacturing costs, improving heat dissipation area, and improving heat dissipation efficiency.

Inactive Publication Date: 2004-04-28
吴春福
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in terms of the current planer-type processing technology, the processing difficulty is much higher than that of aluminum extrusion, and the precision requirements of the machine tools are also high, so that the general mass production and yield rate still need to be improved. In addition

Method used

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  • Radiator and its producing method
  • Radiator and its producing method
  • Radiator and its producing method

Examples

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Example Embodiment

[0036] Refer to image 3 A preferred embodiment of the heat sink 1 of the present invention includes a plurality of fins 11 and a plurality of connecting fins 12.

[0037] Each fin 11 is a sheet-like body with a relatively thin thickness, so that the fins can be divided into a heat dissipation portion 111 and a joint portion 112 connected to each other. In this example, the heat dissipation portion 111 is further formed in a wave shape, thereby improving the contact with the air. The contact area is expected to improve heat dissipation efficiency. Of course, the shape of the heat dissipating portion 111 is not limited to the wave shape. Those skilled in the art can easily produce different shapes to achieve the same effect of increasing the contact area with the air, and no examples are given here.

[0038] The area of ​​each connecting piece 12 is generally slightly smaller than the area of ​​the joint 112 of the fin 11 but has a certain thickness, so that each connecting piece 1...

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Abstract

A radiator contains many fins and connecting plates among which, the fins include a radiating part and a joint part and the connecting plates are placed at the joint part between two adjacent fins and adhered to it. The process method is to utilize moulds to produce many connected fins on a metal strip continuously and generate many connecting plates then to cut the connected fins to single fins then take a certain number of fins and connecting plates and a melting device to adhere the joint parts of the fins increasing radiation are as of fins and their density.

Description

【Technical field】 [0001] The invention relates to a heat sink and a manufacturing method thereof, in particular to a heat sink with rapid production and significantly improved heat dissipation performance and a method for making the heat sink. 【Background technique】 [0002] figure 1 and figure 2 A conventional heat sink 3 produced by aluminum extrusion and a heat sink 5 produced by a planer method are respectively described. [0003] The heat sink 3 includes a base 31, the surface of the base 31 is integrally connected with a plurality of parallel and parallel cooling fins 32, after the bottom surface of the base 31 contacts a heating component 4 such as a central processing unit chip, the heat of the heating component 4 can be dissipated. After being transmitted to each fin 31 , heat exchange is performed with the air, thereby reducing the temperature of the heating element 4 . [0004] And because the operating frequency of the central processing unit chip tends to be...

Claims

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Application Information

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IPC IPC(8): G06F1/20H01L23/34H05K7/20
Inventor 吴春福
Owner 吴春福
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