Semiconductive glaze, its making method and insulator using said glaze
A technology of semi-conductivity and manufacturing method, applied in the direction of insulators, circuits, electrical components, etc., can solve the problems of not being able to obtain the pressure effect of the coating glaze, the reduction of the pressure effect, and the reduction of the strength of the insulator
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Embodiment 1
[0031] A metal oxide was prepared by mixing 94 wt% tin oxide, 5 wt% antimony oxide and 1 wt% niobium oxide. In addition, it is prepared to use the Segel glaze formula, and the chemical composition contains KNaO, MgO, and CaO mixed to achieve the values shown in Table 1 below, and further contains 0.7Al 2 o 3 , 5.0 SiO 2 base glaze. Next, 30 wt% of the prepared metal oxide and 70 wt% of the base glaze were mixed to prepare a glaze composition. Afterwards, with respect to the 100wt% glaze composition, add boron oxide as a flux to the value shown in the following table 1, further add 65wt% water, pulverize and mix with a ball mill, as shown in the following table 1, make the examples of the present invention and comparison Example of semi-conductive glaze for slurry.
[0032]Apply the semiconductive glaze slurry of the inventive example and the comparative example to a 20mm×40mm×60mm plate sample, so that the glaze thickness reaches 0.3-0.4mm, and after drying, calcining at...
Embodiment 2
[0038] As a preferred method, in order to study the Al in the base glaze 2 o 3 and SiO 2 The effect, relative to the 100wt% glaze composition, the amount of boron oxide added as a flux is fixed at 3wt%, and the KNaO, MgO, and CaO of the base glaze are fixed at 0.25KNaO-0.4MgO-0.35 using the Segel glaze formula CaO, in this state, as shown in Table 2 below, changes the Al 2 o 3 and SiO 2 amount to make a semi-conductive glaze. Using the prepared semiconductive glaze, as in Example 1, the surface resistivity and appearance of the sample and the breaking load of the product were determined. The results are shown in Table 2 below. In addition, in Table 2, △ of the appearance indicates a usable minimum state in which many irregularities were observed.
[0039] Base Glaze (Segel Style)
[0040] From the results in Table 2, it can be seen that the Al in the base glaze 2 o 3 and SiO 2 The amount is preferably represented by the Segel glaze formula, Al 2 o 3 : 0.5...
Embodiment 3
[0042] As a preferred mode of the production method, in order to study the effect of the pulverized particle size of the raw material used as the Ca source of CaO constituting the base glaze, the glaze composition, and the raw material of the flux, boron oxide as a flux was used with respect to 100 wt% of the glaze composition. The added amount is fixed at 3wt%, and the composition of the base glaze is fixed at 0.25KNaO-0.4MgO-0.35CaO-5SiO with a Segel glaze 2 -0.7Al 2 o 3 In the state of , as shown in Table 3 below, the Ca source material and the particle size of the pulverization were changed to produce a semiconductive glaze. Here, wollastonite was compared with previously used calcium carbonate as the Ca source material. In addition, the wt% of the pulverized particles having a particle diameter of 10 μm or more was determined using a pulverized particle measuring machine (Sedigraph). Using the prepared semiconductive glaze, as in Example 1, the surface resistivity and ...
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