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Testing device sensor and testing device

A technology for inspection devices and sensors, applied to measuring devices, instruments, electrical solid devices, etc., can solve the problem that it is impossible to inspect circuit patterns with high resolution

Inactive Publication Date: 2004-11-10
OHT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is impossible to inspect circuit patterns on the order of 50 micrometers with high resolution, and in addition, even larger conductive patterns cannot detect this defect

Method used

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  • Testing device sensor and testing device
  • Testing device sensor and testing device
  • Testing device sensor and testing device

Examples

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Embodiment Construction

[0023] Hereinafter, an embodiment example of the present invention will be described in detail with reference to the drawings. In addition, the present invention is not limited to the relative arrangement, numerical values, etc. of the components described below, especially not to the specific description, and the scope of the present invention is not limited to the range described below.

[0024] As an example of an embodiment of the present invention, an inspection device using a MOSFET as a sensor element will be described.

[0025] First, refer to figure 1 The inspection system of the conductive pattern in this embodiment will be described. figure 1 It is a schematic configuration diagram showing an inspection system according to an embodiment of the present invention.

[0026] figure 1 Among them, 20 is an inspection system of this embodiment, and the inspection system 20 inspects whether the conductive pattern 101 formed on the circuit board 100 is normal. The ins...

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Abstract

Disclosed is an inspection sensor and inspection apparatus capable of accurately inspecting the shape of a conductive pattern. A sensor element 12a includes an MOSFET, and an aluminum electrode (AL) serving as a passive element 80. The passive element or aluminum electrode 80 is connected to the gate of a MOSFET 81 and the source of a MOSFET 82. A voltage VDD is supplied from a power supply circuit 18 to the drain of the MOSFET 81, and the source of the MOSFET 81 is connected to the drain of a MOSFET 83. A reset signal is entered from a vertical selection section 14 into the gate of the MOSFET 82, and the voltage VDD is supplied from the power supply circuit 18 to the drain of the MOSFET 82. A selection signal is entered from the vertical selection section 14 into the gate of the MOSFET 83, and an output from the source of the MOSFET 83 is entered into a lateral selection section 13.

Description

technical field [0001] The present invention relates to a sensor for an inspection device and an inspection device for inspecting a conductive pattern of a circuit board. Background technique [0002] When manufacturing a circuit substrate, after forming a conductive pattern on the circuit substrate, it is necessary to check whether there is an open circuit or a short circuit in the formed conductive pattern. [0003] Conventionally, as an inspection method of a conductive pattern, a contact type inspection method is known in which, even if pins are in contact with both ends of the conductive pattern, an electrical signal is supplied from the pin on one end side to the conductive pattern, and the electrical signal is received from the other end side, by This performs a continuity test of the conductive pattern and the like. [0004] However, in recent years, with the increase in the density of conductive patterns, there is no sufficient interval for placing and contacting p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/02G01R31/312H01L21/822H01L27/04H05K3/00
CPCG01R31/312
Inventor 藤井达久门田和浩笠井干也石冈圣悟山冈秀嗣
Owner OHT