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Method for manufacturing image sensor

A technology for image sensors and packaging substrates, which is applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve the problems of not being able to provide image sensor grain grounding, restricting the grounding position, and affecting the image sensor grain circuit layout, etc. , to achieve the effect of reducing the gold-plated area, improving reliability, and reducing manufacturing costs

Inactive Publication Date: 2004-11-17
王鸿仁
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the checkerboard-like crystal base 84C will produce voids 841C, and the voids 841C cannot provide grounding for the image sensor die. There is still a need to improve the design of the crystal base

Method used

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  • Method for manufacturing image sensor
  • Method for manufacturing image sensor
  • Method for manufacturing image sensor

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Embodiment Construction

[0039] see Figure 1 to Figure 5 , shown in the figure is the selected embodiment structure of the present invention.

[0040] see figure 1 , the method for manufacturing an image sensor of this embodiment, which includes the following steps:

[0041] 1. Substrate production:

[0042] A substrate 10 with a metal layer is planned into a plurality of packaging substrate 11 regions arranged in a matrix. The two sides of the substrate 10 are respectively defined as a top surface 101 and a bottom surface 102. The metal layers of the bottom surfaces 101 and 102 respectively form a plurality of internal wiring 15, external wiring 12 and a crystal base 16 located in the central part of the top surface 101, and each package substrate is respectively drilled with a blind hole (or bowl hole) 13 corresponding to the external wiring. And with the side border of each package substrate as the center of the blind hole, the internal wires and external wires of each package substrate are co...

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Abstract

The invention is a method for manufacturing image sensor, a base board is distributed into several sealing base boards with most matrix type, a blind hole or a bowl hole are drilled on the base board at one side of the sealing where is correspondent to the wire, a penetration hole is drilled on the top and the bottom wiring part of the sealing base board, a metal layer is coated in each hole, then, forming the frame dam, adhering the image sensor particle, the sealing cover and cutting along the edge of the board, thus the blind hole becomes the side of the external connection line.

Description

technical field [0001] The invention relates to a method of manufacturing an image sensor. Background technique [0002] FIG. 10 shows a manufacturing process of an existing image sensor. The manufacturing process is mainly to plan a plurality of packaging substrates 81 arranged in a matrix on a substrate 80, and each side of each packaging substrate is provided with a long strip. Separation grooves 82 are used to form the blocks of each package substrate 81. The substrate 80 includes a metal layer, and a plurality of wires (Leads) 83 are formed by photomask etching (Etching). When each separation groove 82 is opened, it corresponds to each wire. The positions of the semi-circular holes 821 are set respectively, such as Figure 11 As shown, the wires on the top and bottom surfaces of the package substrate are electrically connected after metal plating. Next, a grid-shaped cover plate 9 is adhered on the substrate 80. The cover plate 9 has a plurality of windows 91 arranged ...

Claims

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Application Information

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IPC IPC(8): H01L21/50
CPCH01L2224/32225H01L2224/48091H01L2224/48227H01L2224/48465H01L2224/49171H01L2224/73265H01L2224/97H01L2924/16195
Inventor 王鸿仁
Owner 王鸿仁