Method and apparatus for controlling thickness uniformity of electroplated layers

Abstract

An apparatus which can control thickness uniformity during deposition of conductive material from an electrolyte onto a surface of a semiconductor substrate is provided. The apparatus has an anode which can be contacted by the electrolyte during deposition of the conductive material, a cathode assembly including a carrier adapted to carry the substrate for movement during deposition, and a conductive element permitting electrolyte flow therethrough. A mask lies over the conductive element and has openings permitting electrolyte flow. The openings define active regions of the conductive element by which a rate of conductive material deposition onto the surface can be varied. A power source can provide a potential between the anode and the cathode assembly so as to produce the deposition. A deposition process is also disclosed, and uniform electroetching of conductive material on the semiconductor substrate surface can additionally be performed.

Description

technical field [0001] This invention relates to electrodeposition processing technology, and more particularly to electrodeposition processing and apparatus for producing planar deposited layers. Background technique [0002] Conventional semiconductor devices generally include a semiconductor substrate, usually a silicon substrate; several successively formed dielectric layers, such as silicon dioxide layers; and conductive lines or interconnections made of conductive substances. Interconnects are typically formed by filling conductive substances into trenches etched into a dielectric layer. In integrated circuits, multi-layered interconnections extend laterally across the surface of the substrate. Interconnects formed at different levels are electrically connected using vias and contacts. Filling of such components with a conductive substance, ie via openings, slots, pads or contacts, can be carried out by depositing a conductive substan...

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Problems solved by technology

Because a non-uniform copper thickness can cause problems during CMP

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