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System for embossing carrier tape and method for producing carrier tape

A carrier tape and molding technology, which is applied in packaging, applications, electrical components, etc., can solve problems affecting molding parts

Inactive Publication Date: 2005-01-26
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the arrangement of the heating part and the forming part very close to each other is subject to mechanical constraints, and the high temperature in the heating part may affect the shape of the forming part.

Method used

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  • System for embossing carrier tape and method for producing carrier tape
  • System for embossing carrier tape and method for producing carrier tape
  • System for embossing carrier tape and method for producing carrier tape

Examples

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Embodiment Construction

[0025] The carrier tape molding apparatus of the present invention is a method in which when a long sheet-like tape made of thermoplastic resin is intermittently conveyed in a pitch conveying manner, the tape is heated at a heating section and the tape is heated by thermoforming at a molding section. A carrier tape molding device for carrying out molding processing, the device includes a heat preservation part arranged between the heating part and the molding part, and its length is approximately equal to a pitch. In the device of the present invention, preferably, the heating plate of the heating portion has a length obtained by adding a length of a rib-shaped portion and a length of a pitch.

[0026] The method for producing a carrier tape of the present invention includes: when a long sheet-shaped tape made of thermoplastic resin is intermittently conveyed in a pitch conveying manner, heating the tape at a heating section, and maintaining the heated tape at a heat-retaining ...

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PUM

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Abstract

An apparatus for embossing a carrier tape by heating the tape at a heating portion and embossing the tape by heat molding at a molding portion while a long sheet of the tape made of a thermoplastic resin is intermittently transferred by pitch transfer, the apparatus comprising a temperature-maintaining portion having a length approximately corresponding to one pitch disposed between the heating portion and the molding portion; and a process for producing a carrier tape using the apparatus, the process comprising heating the tape at a heating portion, maintaining a temperature of the heated tape at a temperature-maintaining portion and embossing the tape by heat molding at a heat molding portion while a long sheet of the tape is intermittently transferred by pitch transfer. The length of the rib portion connecting embossed portions is decreased by contriving the heating method of the tape.

Description

technical field [0001] The present invention relates to a carrier tape embossing device and a carrier tape production method. More particularly, the present invention relates to a carrier tape molding apparatus and a carrier tape production method capable of reducing the length of a rib-shaped portion connected to a molded portion accommodating electronic parts and increasing the number of accommodating electronic parts. Background technique [0002] Surface mounting of electronic components on equipment is more widely practiced to rationalize products and accommodate increases in product types and decreases in numbers. Since this type of package is suitable for assembly, molded carrier tapes made of thermoplastic resins are widely used. Such as figure 1 As shown, a carrier tape for accommodating various electronic parts such as semiconductors, parts of high-precision equipment, and other very small parts has a plurality of embossed portions 2 as made of thermoplastic resi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C35/04B29C35/08B29C51/08B29C51/18B29C51/26B29C51/42B29L7/00B65B15/04B65B47/02B65B47/08H01L21/00H05K13/00
CPCB29C35/045B29C51/082B29C51/421B65B47/08B29C51/424B65B47/02B29C51/261H05K13/0084B29C51/18B29K2105/256H01L21/67132B29C2035/0822H05K13/003
Inventor 大塚博
Owner SUMITOMO BAKELITE CO LTD