Magnetic tunnel junction and memory device including the same
A technology of magnetic tunnel junction and random access memory, which is applied in the field of manufacturing MRAM devices with multi-layer free magnetic layers, and can solve problems such as increased power consumption and operational failures
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0055] The invention will now be described in detail with reference to several preferred but non-limiting examples.
[0056] At least part of the invention is characterized by a magnetic tunnel junction (MTJ) comprising a multi-laminated free magnetic layer. see Figure 10(A) and 10(B) , which shows the comparison between the conventional free magnetic layer and the multilayer free magnetic layer of an embodiment of the present invention.
[0057] As shown in FIG. 10(A), the conventional free magnetic layer is composed of a layer of NiFe stacked on a CoFe layer. These layers are thicker. For example, the CoFe layer is about 10 angstroms thick and the NiFe layer is about 30 angstroms thick, resulting in a total free magnetic layer thickness of about 40 angstroms. As previously explained, these thick layers of MTJs, especially the NiFe layers, contain large and irregular grains that form numerous domain walls that reduce magnetization uniformity.
[0058] In contrast, as sh...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 