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Packing method and structure of optical fiber optical element

A technology of optical devices and packaging methods, applied in the direction of coupling of optical waveguides, etc., can solve the problems of difficult operation, affecting the stability of optical performance, increasing the overall component volume and material cost, etc.

Inactive Publication Date: 2005-03-30
BROWAVE CORP
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

However, during the solder preparation process, the components will be heated, and at the same time need to adjust the optical coupling, which is not easy to operate; the micro-stress caused by the solder preparation process will gradually release, which will affect the optical performance and long-term stability; in addition, it must be used additionally Two metal casings and two glass casings, and the metal casing and the outer sealing tube need to be plated with gold to be tightly bonded to the solder, which will increase the overall component volume and material cost

Method used

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  • Packing method and structure of optical fiber optical element
  • Packing method and structure of optical fiber optical element
  • Packing method and structure of optical fiber optical element

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Embodiment Construction

[0050] figure 2 It is a schematic diagram of a sub-combination 310 of an optical device, which is a miniaturized optical plug-and-take filter connected in series by various optical components, which includes: a double fiber pigtail 210, a first graded-index lens 200, a filter (WDM Filter ) 230, the second graded index lens 201, the single optical fiber pigtail 220 and the optical fibers 270, 271, 272, the cement 250 is used to strengthen the interface between each interface, image 3 It is a schematic diagram of the packaging of the miniaturized optical plug filter of the present invention, and the packaging method is as follows: a housing cap (housing cap) 241 with a length of d3 is inserted outside the double optical fiber pigtail 210, and its material needs to be able to completely isolate water vapor. And have appropriate thermal expansion coefficient and properties such as not easy to rust, it can be metal or glass or pottery, the gap 291 between this ring cap 241 and do...

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Abstract

The invention includes a subcombination of optical fibre optical device with extended optical fibre, a ring cap, a sleeve and an external package pipe, a binding agent can be infiltrated into miniature gap between subcombination of said optical fibre optical device and all the components by utilizing capillary action so as to attain the goal of compact combination and sealed package. This combination mode is different from and superior to that of general optical component by using tin soldering paste.

Description

technical field [0001] The invention relates to a packaging method and structure of an optical device for optical fiber communication, in particular to a packaging method that uses capillary action to penetrate a bonding agent into a subassembly of an optical device and a small gap between each component to achieve dense bonding and sealing with structure. Background technique [0002] At present, the packaging of optical components for general optical fiber communication is mostly to use bonding agent to bond the optical components and necessary components together to form a sub-assembly (sub-assembly), and then package them into an integrally sealed product with soldering technology. figure 1 It shows a package cross-sectional view of a known optical add / drop filter manufactured by soldering technology, which first uses bonding agent to combine the components into a common port 30 and a pass port port) 31, and then combine the incident end 30 and the penetrating end 31 by...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/24G02B6/26
Inventor 黄裕文高瑞成黄智伟
Owner BROWAVE CORP
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