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Module and method of manufacturing module

A manufacturing method and technology of micro-components, applied in semiconductor/solid-state device manufacturing, printed circuit manufacturing, multi-layer circuit manufacturing, etc., can solve problems such as inability to obtain mounting strength and reliability

Inactive Publication Date: 2005-04-06
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

If the resin 90 cannot fill all the gaps between the device 80 and the substrate 70, sufficient mounting strength and reliability cannot be obtained.

Method used

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  • Module and method of manufacturing module

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Embodiment Construction

[0028] figure 1 It is a cross-sectional view of the ceramic micromodule 1 according to the embodiment of the present invention. figure 2 is a top view of the ceramic substrate 13 of the micro-component 1 . The ceramic micromodule 1 has a ceramic substrate 13 . The ceramic substrate 13 has internal electrodes 2 formed in layers, via electrodes 3 for connecting the internal electrodes 2 , and a ceramic material 14 which is an insulating material. Components 6 such as chip resistors, multilayer ceramic capacitors, and chip coils have a main body 6A and end surface electrodes 15 . Active device 8 such as an IC or a SAW filter has body 8A and bump electrodes 16 . The end electrode 15 of the device 6 and the bump electrode 16 of the active device 8 are connected to the pad electrode 4 with the flux 7 , and the devices 6 and 8 are arranged on the surface 13A of the substrate 13 . On the lower bottom surface 13B of the ceramic substrate 13, the back electrode 5 for mounting the ...

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Abstract

A module (1) includes a ceramic substrate (13), first and second electrodes (4) provided on the ceramic substrate (13), a component (6,8) having third and fourth electrodes (15,16) connected to the first and second electrodes (4), respectively, and a resin (9,11) filled in a space between the component (6,8) and the ceramic substrate (13). The ceramic substrate (13) has a surface thereof having a recess (10A,10B) formed therein. The first and second electrodes (4) are provided on the surface of the ceramic substrate (13) so that the recess (10A,10B) is located between the first and second electrodes (4). The component (6,8) is located over the recess (10A,10B) and spaced from the ceramic substrate (13) with a space including the recess (10A,10B). The space including the recess (10A,10B) is filled with the resin (9,11). The module allows each component (6,8) to be surface mounted at higher bonding strength, thus preventing short-circuit between the electrodes (4) on the substrate and improving the operation reliability.

Description

technical field [0001] The present invention relates to a micro-assembly and a manufacturing method of electronic devices such as ICs, SAW filters, resistors, capacitors, and coils mounted on a ceramic substrate with wiring. Background technique [0002] Ceramic micromodules in which electronic devices such as ICs, SAW filters, various resistors, capacitors, and coils are mounted on a ceramic substrate with wiring are shown in JP-A-3-205857 and JP-A-4-252041. [0003] Figure 18 It is a cross-sectional view of a conventional ceramic micro-module 50 . The ceramic micromodule 50 has devices 60 such as capacitors and coils, active devices 80 such as ICs and SAW filters, and a ceramic substrate 70 . Ceramic substrate 70 includes a plurality of internal electrodes 51, via electrodes 52 for connecting them, pad electrodes 55 for installing active devices 80 and devices 60, and backside electrodes 56 for installing ceramic microcomponents 50 on the motherboard. . The end electro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/12H01L21/48H01L21/56H01L21/60H01L23/13H01L23/31H01L23/498H01L25/065H01L25/16H03H9/10H05K1/03H05K3/28H05K3/30
CPCH01L2224/73203H01L2924/19105H01L25/16H01L23/3121H03H9/0557H01L2224/81801H01L2924/09701H01L2924/15192H01L2924/01019H01L23/49822H01L23/13H01L2924/15151H01L2924/19041H01L21/563H05K2201/10674H01L2924/014H01L2924/01013H03H9/1085H01L2224/32225H05K3/305H01L24/81H01L2924/19043H01L2924/01047H01L2224/73204H01L2924/14H01L2924/19042H01L2924/01005H01L2924/01033H01L2924/01006H03H9/0542H05K2201/09036H05K1/0306H01L2924/01057H01L2924/01075H01L2224/16225H01L21/4857H05K3/284H05K2201/10636H01L2224/16235H01L2924/15787H01L2924/181H01L2924/12042H01L2224/05568H01L2224/05023H01L2224/05001H01L2924/00014Y10T29/435Y10T29/49163Y10T29/43Y10T29/49165Y10T29/49171Y10T29/49126Y02P70/50H01L2924/00H01L2224/05599H01L2224/05099
Inventor 齐藤隆一加贺田博司胜又雅昭
Owner PANASONIC CORP
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