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LED chip module

A technology of light-emitting diodes and chip modules, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., and can solve problems such as limited heat dissipation, bulky volume, and increased cost

Inactive Publication Date: 2005-07-06
林文钦
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the substrate not only affects the luminous stability of the light-emitting diodes, but in practical applications, due to the design of its structure, the heat dissipation effect is still limited.
And taking the advertising billboard as an example, many light-emitting diode chip modules need to be assembled, and the high heat generated by them still needs to be processed separately, which makes the assembly complicated, bulky and costly
[0006] It can be seen from the above that the above-mentioned known light-emitting diode chip modules obviously have inconveniences and defects in actual use, and need to be improved.

Method used

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Embodiment Construction

[0042] see Figure 2 to Figure 5 As shown, the present invention is a light-emitting diode chip module, including a heat-conducting seat 1, an insulating member 2, two conductive pins 3 and a light-emitting diode chip 4, wherein:

[0043] The heat conduction seat 1 has a seat body 10 , a receiving portion 11 is protruded on the top surface of the seat body 10 , and a receiving groove 12 is recessed at the top of the receiving portion 11 . A convex ring portion 13 protrudes from the top surface of the seat body 10 . A concave ring portion 14 is formed between the convex ring portion 13 and the receiving portion 11 . The concave ring portion 14 is provided with two through holes 15 .

[0044] The insulator 2 has a base 20 provided with a through hole 21 . Two insulating pillars 22 protrude from the bottom surface of the base 20 . The base portion 20 is accommodated in the concave ring portion 14 of the heat conduction seat 1, the through hole 21 of the insulating member 2 is s...

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Abstract

A LED chip module contains heat conductive holder, insulator, two conductive pins and LED chip wherein the heat conductive holder having through hole, said insulator having base part with through hole, insulation column in bottom positioned in through hole, the insulation column having exposed through hole where the two pins are located, said LED chip located in through hole of insulator and fixed at heat conductive holder, the positive and negative pole of said chip connected with two pins by wire. Said invention greatly raises the radiation efficiency with easy assembling, small volume and low cost.

Description

technical field [0001] The invention relates to a light emitting diode chip module, in particular to a light emitting diode chip module with high brightness and good heat dissipation. Background technique [0002] As we all know, with the rapid development of the optoelectronic industry, light-emitting diode chips greatly increase their brightness and are widely used in display panels. Take the advertising billboard as an example, the dynamic display of patterns and characters can be achieved by means of light-emitting diodes arranged in a dot matrix, making the advertising effect more clear and eye-catching. The high-brightness characteristic of light-emitting diode chips is accompanied by high temperature, which must be effectively dissipated in order to maintain normal use for a long time. [0003] Known light-emitting diode chip module, please refer to figure 1 As shown, it includes a light-emitting diode chip 70, a first pin 71, a second pin 72 and a cover 73. One end...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/38
Inventor 熊麒
Owner 林文钦
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