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Film adhesives containing maleimide and related compounds and methods for use thereof

A technology of maleimide and itaconic imide, used in polyether adhesives, conductive adhesives, adhesive types, etc., can solve problems such as unreliable component performance

Inactive Publication Date: 2005-08-03
HENKEL CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Additionally, adhesive fillets and resin bleed are known to cause unreliable component performance associated with many adhesive formulations

Method used

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  • Film adhesives containing maleimide and related compounds and methods for use thereof
  • Film adhesives containing maleimide and related compounds and methods for use thereof
  • Film adhesives containing maleimide and related compounds and methods for use thereof

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Embodiment

[0290] The adhesive composition of the present invention is prepared as follows. Using styrene-butadiene block copolymer KRATON TM D-1102 was used as the thermoplastic elastomer component to prepare the adhesive film composition 1 of the present invention. Octadecylmaleimide and X-BMI (X-BMI is a 1,20-bismaleimide derivative of 10,11-dioctyleicosane) were used as macromonomers. The maleimides used in the following adhesive film compositions of the present invention were prepared according to the procedure outlined in US Patent No. 5,973,166, the entire contents of which are incorporated herein by reference.

[0291] Adhesive film composition of the present invention 1

[0292] 1. Octadecylmaleimide 1.0g

[0293] 2. KRATON TM D-1102 2.5g

[0294] 3. X-BMI 1.5g

[0295] 4. Ricon 130 1 0.2g

[0296] 5. Silane coupling agent 2 0.2g

[0297] 6. Dicumyl peroxide 0.05g

[0298] 7. Xylene 5.0g

[0299] 8. TEFLON TM Filling 6.9g

[0300] 1. Polybutadien...

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Abstract

In accordance with the present invention, there are provided film adhesive compositions comprising at least one macromonomer having at least one unit of ethylenic unsaturation, at least one thermoplastic elastomer co-curable with the macromonomer, and at least one cure initiator, and methods for use thereof. Invention compositions are useful as adhesives in the microelectronics industry. In particular, invention film adhesives may be used to produce microelectronic assemblies with very thin bond lines without compromising adhesive strength.

Description

[0001] related application [0002] This application is a continuation-in-part of co-pending US Patent Application Serial No. 10 / 113,909, filed March 28, 2002, which is hereby incorporated by reference in its entirety. technical field [0003] The present invention relates to adhesive film compositions, and more particularly to the use of adhesive film compositions in stacked die microelectronic packaging applications. Background technique [0004] In response to the increased demand for smaller but more functional semiconductor packages, the microelectronic packaging industry has recently begun producing packages containing at least two stacked semiconductor die. In fact, it is often advantageous to stack multiple dies into the same package in order to increase circuit density without increasing the area on the circuit board occupied by the integrated circuit package. [0005] Several challenges exist in producing reliable electronic components containing stacked die packa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J179/08C08F2/00C08F8/30C08F290/02C08L79/08C09J9/02C09J11/00C09J109/00C09J123/00C09J153/00C09J157/00C09J157/10C09J167/00C09J171/00C09J175/04C09J183/04C09J201/00H01L21/58H01L25/065
CPCH01L2924/01015H01L24/28C08L79/085H01L2924/01023H01L2924/01082H01L2924/01004H01L2924/01018H01L2924/01019H01L2924/01029H01L2924/01027H01L2924/19041H01L2924/01013C09J179/085H01L2924/01039H01L2924/01024H01L2924/0665H01L2224/2919H01L2924/19043H01L2924/01047H01L2924/01079H01L2924/14H01L24/83H01L2224/8388H01L2924/01005H01L2924/01033H01L2924/01006C08F290/02H01L2924/01074H01L2924/10253C08F8/30H01L2224/8319H01L25/0657H01L2924/01012H01L2924/07802C08L2666/24H01L2924/00C09J179/04
Inventor 刘圃伟S·M·德施姆杨钢C·C·阿尔比诺
Owner HENKEL CORP